Circuit Board Materials

Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.
The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials
(which includes substrates, encapsulants and underfills) and electronic assembly materials.
Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.

Major application	Product name	Product number	Features / Proposals	Detailed application
ICT infrastructure equipment	Low transmission loss multi-layer materials	series	Multi-layer circuit board materials suitable to large capacity and high speed transmission of high frequency signal
ICT infrastructure equipment	Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials	Laminate : R-5795(U) R-5795(N) Prepreg : R-5690(U) R-5690(N)	Dk 3.1 Df 0.0012 @14GHz Tg (DMA) 220°C T288 (with copper) >120min.	Routers, switches, optical transmission equipment, servers, AI servers, base stations, semiconductor test equipment, probe cards, etc.
ICT infrastructure equipment Aerospace	Ultra-low transmission loss multi-layer circuit board materials	Laminate : R-5785(N) R-5785(GN) R-5785(GE) R-5785(R)* Prepreg : R-5680(N) R-5680(GN) R-5680(GE) *Buried Resistor Copper Foil	High speed & ultra-low transmission loss High reliability Lead-free soldering	High-end servers, High-end routers, Supercomputers, and other ICT infrastructure equipment, Antenna(Base station, Automotive millimeter-wave radar), etc.
ICT infrastructure equipment	Halogen-free Ultra-low transmission loss Multi-layer circuit board materials	Laminate : R-5375(N) R-5375(E) Prepreg : R-5370(N) R-5370(E)	Dk 3.4 Df 0.003@12GHz Tg (DMA) 250°C T320 (with copper) >120min.	ICT infrastructure equipment, High speed networking(High-end server/ router, Optical network, switch), High layer count PCB, etc.
ICT infrastructure equipment Aerospace	Ultra-low transmission loss multi-layer circuit board materials	Laminate : R-5775(N) R-5775(K) R-5775(G) R-5775(S)* R-5775(R)* Prepreg : R-5670(N) R-5670(K) R-5670(G) *Buried Resistor Copper Foil	High speed & ultra-low transmission loss High reliability Lead-free soldering	Networking equipment, Mainframe, IC tester, High frequency measuring device, Antenna(Base station, Automotive millimeter-wave radar), etc.
ICT infrastructure equipment	Low transmission loss multi-layer materials	Laminate : R-5725S, R-5725 Prepreg : R-5620S, R-5620	High speed & low transmission loss High reliability Lead-free soldering	Networking equipment(servers, routers), Measuring instruments, Antenna(Base station, Automotive millimeter-wave radar), etc.
ICT infrastructure equipment	Low transmission loss multi-layer materials	Laminate : R-5735 Prepreg : R-5630	High speed & low transmission loss High reliability Lead-free soldering	Networking equipment (servers, routers), etc.
ICT infrastructure equipment	Low transmission loss multi-layer materials	Laminate : R-1577, R-1577E Prepreg : R-1570, R-1570E	High speed & low transmission loss High heat resistance Halogen free	Networking equipment(servers, routers), Measuring instruments, Automotive components, etc.
ICT infrastructure equipment	High heat resistance (High-Tg) multi-layer circuit board materials	Laminate : R-1755V Prepreg : R-1650V	High heat resistance High reliability Low CTE	Networking equipment (servers, routers), Measuring instruments, Automotive components, etc.
Automotive Antenna	Multi-layer Circuit Board Materials for wireless/ RF communication equipment	series	Multi-layer circuit board materials that achieve low transmission losses in Radio Frequency range.
Automotive Antenna	Halogen-free Ultra-low transmission loss Multi-layer Circuit board materials	Laminate : R-5515 Prepreg : R-5410	Dk 3.0 Df 0.002@10GHz Tg (DMA) 200°C Halogen-free	Antenna(Automotive millimeter-wave radar, Base station), etc.
Automotive Antenna	High thermal conductivity Low transmission loss Halogen-free Multi-layer circuit board materials	Laminate : R-5575 Prepreg : R-5470	Dk 3.6 Df 0.005@10GHz Tg (DMA) 245°C Thermal conductivity 0.60W/m･K	Power amplifier board(Base station for wireless communication, Small cell), Antenna(Base station), etc. Antenna(Automotive millimeter-wave radar, Base station), etc.
IC package	Narrow pitch corresponding circuit board materials	series	Contribute to IC substrates as thinner and smaller and low warpage
IC package	Ultra-low transmission loss Circuit board materials for IC substrate/Module	Laminate : R-G545L, R-G545E Prepreg : R-G540L, R-G540E	Df 0.003 Dk 3.5@12GHz CTE x, y-axis 10ppm/℃ Tg (DMA) 230℃	IC PKG for base station application, Module part, etc.
IC package	High modulus Low CTE IC substrate materials	Laminate : R-G535S, R-G535E	CTE x, y-axis 4-6ppm/°C Low Package Warpage(FC-BGA) Good MTH Processability(Mechanical Through Hole)	IC substrate(FC-BGA)
IC package	Low stress materials for thinner IC substrate	Laminate : R-G525T, R-G525F Prepreg : R-G520T, R-G520F	Low stress Excellent warpage performance Considerable cost advantage (E-glass)	FC-CSP
IC package	Low CTE Ultra-thin IC substrate materials	Laminate : R-G515S, R-G515E Prepreg : R-G510S, R-G510E	CTE x,y-axis 4-6ppm/℃　(Low CTE glass cloth) Low warpage Ultra-thin, Excellent moldability	IC substrate CSP (PoP-Bottom, Flip-Chip, Memory, Module, etc.)
IC package	Low CTE IC substrate materials Designed to Improve Reliability	Laminate : R-1515V Prepreg : R-1410V	CTE x, y-axis 3-5ppm/°C (Low CTE glass cloth) Stress Relaxation Good Thickness Variation	IC substrate FC-BGA (CPU, GPU, FPGA, ASIC, etc.)
IC package	Narrow pitch corresponding circuit board materials	Laminate : R-1515W Prepreg : R-1410W	High heat resistance Low CTE Mechanical drilling-ability	FC-BGA
IC package	Narrow pitch corresponding circuit board materials	Laminate : R-1515A Prepreg : R-1410A	High heat resistance Mechanical drilling-ability Halogen-free	FC-BGA
IC package	Ultra-thin circuit board materials	Laminate : R-1515E Prepreg : R-1410E	Low warpage Corresponding to ultra-thin Halogen-free	CSP
Automotive	High heat resistance multi-layer materials	series	Lineup of multi-layer circuit board materials with excellent high heat resistance and high reliability
Automotive	High heat resistance (High-Tg) multi-layer circuit board materials	Laminate : R-1755D Prepreg : R-1650D	High heat resistance High reliability High reliability of solder connection	Engine room ECU (direct mounting to the engine)
Automotive	High heat resistance (Middle-Tg) multi-layer circuit board materials	Laminate : R-1755M Prepreg : R-1650M	High heat resistance High reliability Low CTE	Automotive components (Engine room ECU), Electronic devices that require high reliability (use of lead-free solder), etc.
Automotive	High heat resistance multi-layer circuit board materials	Laminate : R-1755E Prepreg : R-1650E	High heat resistance High reliability Low CTE	Automotive components (Engine room ECU), Electronic devices that require high reliability (use of lead-free solder), etc.
LED lightings	High thermal conductive glass composite circuit board materials	Double-sided : R-1787	High heat dissipation Tracking resistance High reliability	LED back lights, LED lightings, Power Supply etc.
Automotive Power module	High thermal conductive Bonding sheet	R-14T1	High heat dissipation Tracking resistance	Automotive Adhesive sheet application
Mobile products	Flexible circuit board materials	series	We meet the diverse mounting needs of mobile products such as smartphones and digital appliances
Mobile products	Flexible circuit board materials	R-F775	Spring back performance Dimensional stability High heat resistance	Smartphone (Casing edge, Slide keyboard), DSCs (Camera module), LCD module, etc.
Mobile products Automotive	LCP flexible circuit board materials	Double-sided copper clad : R-F705S	Low transmission loss High frequency characteristics Moisture resistance	Smartphone(FPC Antenna(LTE, WiFi), LCD module), Networking equipment, Note PC·Tablet PC(High-speed FPC Cable), Antenna(Base station, Automotive millimeter-wave radar), etc.
Mobile products	Low transmission loss flexible multi-layer circuit board materials	Low Dk bonding sheet : R-BM17 Core : R-F705	Thinner replacement of coaxial cable Better handling at fabrication Faster & lower loss for FPC cable	Antenna module for mobile product (Smartphone, tablet PC)　etc.
Mobile products	Flexible circuit board materials resin coated copper foil	Material for thinner, multilayed : R-FR10	Can be multi-layered thin Decrease a manufacture process Halogen-free	Smartphone (Main board, Subboard, Module board), HDI board, etc.
Automotive Mobile products	Halogen-free multi-layer circuit board materials	series	Lineup of environment-friendly materials corresponding to the various application of mobile products.
Automotive Mobile products	Halogen-free multi-layer circuit board materials	Laminate : R-1566, R-1566(W) R-1566(WN) Prepreg : R-1551, R-1551(W) R-1551(WN)	Halogen free High reliability Tracking resistance (CTI: 400V or more but less than 600V)	Automotive components, Mobile products(Mobile phone, Smart phone, Tablet PC, Digital camera), Antenna(Base station), etc.
Automotive	High heat resistance halogen-free multi-layer circuit board materials	Laminate : R-1566S Prepreg : R-1551S	High heat resistance Tg=175℃(DSC) High reliability Tracking resistance (CTI: More than 600V)	Engine Control Unit, etc.
Automotive Industry	High CTI, High RTI Halogen-free multi-layer circuit board materials	Laminate : R-3566D Prepreg : R-3551D	CTI≥600V¹ PLC=0 ¹ Measurement by ASTM method FR-15.1 RTI 150°C² ² 0.63mm or more High voltage CAF resistance (1000V)	On Board Charger, DC/DC Converter, Inverter, In-Wheel Motor, etc. EV Charging Stand, HV Control Unit, PV Module, etc.
Mobile products Automotive	Low Dk halogen-free multi-layer circuit board materials	Laminate : R-A555(W) Prepreg : R-A550(W)	Low Dk Low CTE High heat resistance	Mobile products(smartphone, tablet PC, digital camera, etc.) In-vehicle autonomous driving server
Automotive, etc. (many applications)	Multi-layer circuit board materials	Laminate : R-1766 Prepreg : R-1661	Multilayer molding processability Excellent laminate processability Dimensional stability	Automotive components, Amusement, Digital appliance, Mobile product, Measuring instruments, Small and medium-sized computer, Semiconductor test equipment
Automotive Mobile products, etc. (many applications)	Mass laminations(Shield board)		High multi-layered ～24 layers AOI inspection for all materials Quick delivery	Automotive component, Mobile product(PC and related equipment, Mobile phone, Laptop etc.), Amusement machine, Digital appliance, Measuring instrument, Semiconductor test equipment, Semiconductor memory board, etc.
Automotive Appliance	High reliability Glass composite circuit board materials	Double-sided copper clad : R-1785	CTE x, y-axis 20ppm/℃ Tg (TMA) 150℃ CTI≧600V	Automotive component, Power supply board, Power device module board, Infrastructure(Smart meter, IC tag), etc.
Appliance Antenna	Glass composite circuit board materials	Double-sided copper clad : R-1786 Single-sided copper clad : R-1781	Tracking resistance High reliability Size-free High frequency characteristics	Home appliance, Digital appliance, LED lighting, Meter panel, Power supply system board, Amusement machine, Antenna (5G terminal, equipment), etc.
Appliance High current applications	Thick copper glass composite circuit board materials	Double-sided copper clad : R-1786	High current (Thick copper foil type) Tracking resistance High reliability	Power supply system board, Inverter, converter board Ex: power conditioner and battery of the solar power
Appliance LED lightings	Paper phenolic circuit board materials	Single-sided copper clad : R-8700	Dimensional stability Tracking resistance Punching workability	Digital appliance, Home appliance, LED lightings, Power supply circuit