Circuit Board Materials

Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.
The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials
(which includes substrates, encapsulants and underfills) and electronic assembly materials.
Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.
Major application Product name Product number Features / Proposals Detailed application
ICT infrastructure equipment
ICT infrastructure
equipment
Low transmission loss multi-layer materials MEGTRON
series
Multi-layer circuit board materials suitable to large capacity and high speed transmission of high frequency signal
ICT infrastructure equipmentAerospace
ICT infrastructure
equipment
Aerospace
Ultra-low transmission loss multi-layer circuit board materials MEGTRON7
Laminate :
R-5785(N)
R-5785(GN)
R-5785(GE)
R-5785(R)*

Prepreg :
R-5680(N)
R-5680(GN)
R-5680(GE)

*Buried Resistor
 Copper Foil
  • High speed & ultra-low transmission loss
  • High reliability
  • Lead-free soldering
  • High-end servers, High-end routers, Supercomputers, and other ICT infrastructure equipment, Antenna(Base station, Automotive millimeter-wave radar), etc.
ICT infrastructure equipment
ICT infrastructure
equipment
Halogen-free Ultra-low transmission loss Multi-layer circuit board materials Halogen-fre MEGTRON6
Laminate :
R-5375(N)
R-5375(E)

Prepreg :
R-5370(N)
R-5370(E)
  • Dk 3.4 Df 0.003@12GHz
  • Tg (DMA) 250°C
  • T320 (with copper)>120min.
  • ICT infrastructure equipment, High speed networking(High-end server/ router, Optical network, switch), High layer count PCB, etc.
ICT infrastructure equipmentAerospace
ICT infrastructure
equipment
Aerospace
Ultra-low transmission loss multi-layer circuit board materials MEGTRON6
Laminate :
R-5775(N)
R-5775(K)
R-5775(G)
R-5775(S)*
R-5775(R)*

Prepreg :
R-5670(N)
R-5670(K)
R-5670(G)

*Buried Resistor
 Copper Foil
  • High speed & ultra-low transmission loss
  • High reliability
  • Lead-free soldering
  • Networking equipment, Mainframe, IC tester, High frequency measuring device, Antenna(Base station, Automotive millimeter-wave radar), etc.
ICT infrastructure equipment
ICT infrastructure
equipment
Low transmission loss multi-layer materials MEGTRON4S
MEGTRON4
Laminate :
R-5725S, R-5725
Prepreg :
R-5620S, R-5620
  • High speed & low transmission loss
  • High reliability
  • Lead-free soldering
  • Networking equipment(servers, routers), Measuring instruments, Antenna(Base station, Automotive millimeter-wave radar), etc.
ICT infrastructure equipment
ICT infrastructure
equipment
Low transmission loss multi-layer materials MEGTRON M
Laminate : R-5735
Prepreg : R-5630
  • High speed & low transmission loss
  • High reliability
  • Lead-free soldering
  • Networking equipment (servers, routers), etc.
ICT infrastructure equipment
ICT infrastructure
equipment
Low transmission loss multi-layer materials Halogen-free MEGTRON2
Laminate :
R-1577, R-1577E
Prepreg :
R-1570, R-1570E
  • High speed & low transmission loss
  • High heat resistance
  • Halogen free
  • Networking equipment(servers, routers), Measuring instruments, Automotive components, etc.
ICT infrastructure equipment
ICT infrastructure
equipment
High heat resistance (High-Tg) multi-layer circuit board materials HIPER V
Laminate : R-1755V
Prepreg : R-1650V
  • High heat resistance
  • High reliability
  • Low CTE
  • Networking equipment (servers, routers), Measuring instruments, Automotive components, etc.
AutomotiveAntenna
Automotive
Antenna
Multi-layer Circuit Board Materials for wireless/ RF communication equipment XPEDION
series
Multi-layer circuit board materials that achieve low transmission losses in Radio Frequency range.
AutomotiveAntenna
Automotive
Antenna
Halogen-free Ultra-low transmission loss Multi-layer Circuit board materials XPEDION1
Laminate : R-5515
Prepreg : R-5410
  • Dk 3.0 Df 0.002@10GHz
  • Tg (DMA) 200°C
  • Halogen-free
  • Antenna(Automotive millimeter-wave radar, Base station), etc.
AutomotiveAntenna
Automotive
Antenna
High thermal conductivity Low transmission loss Halogen-free Multi-layer circuit board materials XPEDION T1
Laminate : R-5575
Prepreg : R-5470
  • Dk 3.6 Df 0.005@10GHz
  • Tg (DMA) 245°C
  • Thermal conductivity 0.60W/m・K
  • Power amplifier board(Base station for wireless communication, Small cell), Antenna(Base station), etc.
  • Antenna(Automotive millimeter-wave radar, Base station), etc.
IC package
IC package
Narrow pitch corresponding circuit board materials MEGTRON GX
series
Contribute to IC substrates as thinner and smaller and low warpage
IC package
IC package
Ultra-low transmission loss Circuit board materials for IC substrate/Module MEGTRON GX
Laminate :
R-G545L, R-G545E
Prepreg :
R-G540L, R-G540E
  • Df 0.003 Dk 3.5@12GHz
  • CTE x, y-axis 10ppm/℃
  • Tg (DMA) 230℃
  • IC PKG for base station application, Module part, etc.
IC package
IC package
High modulus Low CTE IC substrate materials MEGTRON GX
Laminate :
R-G535S, R-G535E
  • CTE x, y-axis 4-6ppm/°C
  • Low Package Warpage(FC-BGA)
  • Good MTH Processability(Mechanical Through Hole)
  • IC substrate(FC-BGA)
IC package
IC package
Low stress materials for thinner IC substrate MEGTRON GX
Laminate :
R-G525T, R-G525F
Prepreg :
R-G520T, R-G520F
  • Low stress
  • Excellent warpage performance
  • Considerable cost advantage (E-glass)
  • FC-CSP
IC package
IC package
Low CTE Ultra-thin IC substrate materials MEGTRON GX
Laminate :
R-G515S, R-G515E
Prepreg :
R-G510S, R-G510E
  • CTE x,y-axis 4-6ppm/℃ (Low CTE glass cloth)
  • Low warpage
  • Ultra-thin, Excellent moldability
  • IC substrate
    CSP (PoP-Bottom, Flip-Chip, Memory, Module, etc.)
IC package
IC package
Low CTE IC substrate materials Designed to Improve Reliability MEGTRON GX
Laminate : R-1515V
Prepreg : R-1410V
  • CTE x, y-axis
    3-5ppm/°C
    (Low CTE glass cloth)
  • Stress Relaxation
  • Good Thickness Variation
  • IC substrate FC-BGA
    (CPU, GPU, FPGA, ASIC, etc.)
IC package
IC package
Narrow pitch corresponding circuit board materials MEGTRON GX
Laminate : R-1515W
Prepreg : R-1410W
  • High heat resistance
  • Low CTE
  • Mechanical drilling-ability
  • FC-BGA
IC package
IC package
Narrow pitch corresponding circuit board materials MEGTRON GX
Laminate : R-1515A
Prepreg : R-1410A
  • High heat resistance
  • Mechanical drilling-ability
  • Halogen-free
  • FC-BGA
IC package
IC package
Ultra-thin circuit board materials MEGTRON GX
Laminate : R-1515E
Prepreg : R-1410E
  • Low warpage
  • Corresponding to ultra-thin
  • Halogen-free
  • CSP
Automotive components
Automotive
High heat resistance multi-layer materials HIPER
series
Lineup of multi-layer circuit board materials with excellent high heat resistance and high reliability
Automotive components
Automotive
High heat resistance (High-Tg) multi-layer circuit board materials HIPER D
Laminate : R-1755D
Prepreg : R-1650D
  • High heat resistance
  • High reliability
  • High reliability of solder connection
  • Engine room ECU (direct mounting to the engine)
Automotive components
Automotive
High heat resistance (Middle-Tg) multi-layer circuit board materials HIPER M
Laminate : R-1755M
Prepreg : R-1650M
  • High heat resistance
  • High reliability
  • Low CTE
  • Automotive components (Engine room ECU), Electronic devices that require high reliability (use of lead-free solder), etc.
Automotive components
Automotive
High heat resistance multi-layer circuit board materials HIPER E
Laminate : R-1755E
Prepreg : R-1650E
  • High heat resistance
  • High reliability
  • Low CTE
  • Automotive components (Engine room ECU), Electronic devices that require high reliability (use of lead-free solder), etc.
LED lightings
LED lightings
High thermal conductive glass composite circuit board materials ECOOL
Double-sided :
R-1787
  • High heat dissipation
  • Tracking resistance
  • High reliability
  • LED back lights, LED lightings, Power Supply etc.
Automotive components
Automotive
Power module
High thermal conductive Bonding sheet R-14T1
  • High heat dissipation
  • Tracking resistance
  • Automotive Adhesive sheet application
Mobile products
Mobile products
Flexible circuit board materials FELIOS
series
We meet the diverse mounting needs of mobile products such as smartphones and digital appliances
Mobile products
Mobile products
Flexible circuit board materials FELIOS
R-F775
  • Spring back performance
  • Dimensional stability
  • High heat resistance
  • Smartphone (Casing edge, Slide keyboard), DSCs (Camera module), LCD module, etc.
Mobile productsAutomotive components
Mobile products
Automotive
LCP flexible circuit board materials FELIOS LCP
Double-sided copper
clad : R-F705S
  • Low transmission loss
  • High frequency characteristics
  • Moisture resistance
  • Smartphone(FPC Antenna(LTE, WiFi), LCD module), Networking equipment, Note PC·Tablet PC(High-speed FPC Cable), Antenna(Base station, Automotive millimeter-wave radar), etc.
Mobile products
Mobile products
Low transmission loss flexible multi-layer circuit board materials Low Dk bonding
sheet : R-BM17
Core : R-F705
  • Thinner replacement of coaxial cable
  • Better handling at fabrication
  • Faster & lower loss for FPC cable
  • Antenna module for mobile product (Smartphone, tablet PC) etc.
Mobile products
Mobile products
Flexible circuit board materials resin coated copper foil FELIOS FRCC
Material for thinner,
multilayed : R-FR10
  • Can be multi-layered thin
  • Decrease a manufacture process
  • Halogen-free
  • Smartphone (Main board, Subboard, Module board), HDI board, etc.
Automotive componentsMobile products
Automotive
Mobile products
Halogen-free multi-layer circuit board materials Halogen-free
series
Lineup of environment-friendly materials corresponding to the various application of mobile products.
Automotive componentsMobile products
Automotive
Mobile products
Halogen-free multi-layer circuit board materials Halogen-free
Laminate :
R-1566, R-1566(W)
R-1566(WN)
Prepreg :
R-1551, R-1551(W)
R-1551(WN)
  • Halogen free
  • High reliability
  • Tracking resistance
    (CTI: 400V or more but less than 600V)
  • Automotive components, Mobile products(Mobile phone, Smart phone, Tablet PC, Digital camera), Antenna(Base station), etc.
Automotive components
Automotive
High heat resistance halogen-free multi-layer circuit board materials Halogen-free
Laminate : R-1566S
Prepreg : R-1551S
  • High heat resistance Tg=175℃(DSC)
  • High reliability
  • Tracking resistance
    (CTI: More than 600V)
  • Engine Control Unit, etc.
Automotive componentsIndustry products
Automotive
Industry
High CTI, High RTI Halogen-free multi-layer circuit board materials Halogen-free
Laminate : R-3566D
Prepreg : R-3551D
  • CTI≥600V*¹ PLC=0
    *¹ Measurement by ASTM method
  • FR-15.1 RTI 150°C*²
    *² 0.63mm or more
  • High voltage CAF resistance (1000V)
  • On Board Charger, DC/DC Converter, Inverter, In-Wheel Motor, etc.
  • EV Charging Stand, HV Control Unit, PV Module, etc.
Mobile productsAutomotive components
Mobile products
Automotive
Low Dk halogen-free multi-layer circuit board materials Halogen-free
Laminate : R-A555(W)
Prepreg : R-A550(W)
  • Low Dk
  • Low CTE
  • High heat resistance
  • Mobile products(smartphone, tablet PC, digital camera, etc.)
  • In-vehicle autonomous driving server
Automotive components, etc. (many applications)
Automotive, etc.
(many applications)
Multi-layer circuit board materials Laminate : R-1766
Prepreg : R-1661
  • Multilayer molding processability
  • Excellent laminate processability
  • Dimensional stability
  • Automotive components, Amusement, Digital appliance, Mobile product, Measuring instruments, Small and medium-sized computer, Semiconductor test equipment
Automotive componentsMobile products
Automotive
Mobile products, etc.
(many applications)
Mass laminations(Shield board) PreMulti
  • High multi-layered
    ~24 layers
  • AOI inspection for
    all materials
  • Quick delivery
  • Automotive component, Mobile product(PC and related equipment, Mobile phone, Laptop etc.), Amusement machine, Digital appliance, Measuring instrument, Semiconductor test equipment, Semiconductor memory board, etc.
Automotive componentsAppliance
Automotive
Appliance
High reliability Glass composite circuit board materials Double-sided copper
clad : R-1785
  • CTE x, y-axis 20ppm/℃
  • Tg (TMA) 150℃
  • CTI≧600V
  • Automotive component, Power supply board, Power device module board, Infrastructure(Smart meter, IC tag), etc.
Appliance
Appliance
Glass composite circuit board materials Double-sided copper
clad : R-1786
Single-sided copper
clad : R-1781
  • Tracking resistance
  • High reliability
  • Size-free
  • Home appliance, Digital appliance, LED lighting, Meter panel, Power supply system board, Amusement machine, Antenna(Base station), etc.
Appliance / High current applications
Appliance
High current
applications
Thick copper glass composite circuit board materials Double-sided copper
clad : R-1786
  • High current
    (Thick copper foil type)
  • Tracking resistance
  • High reliability
  • Power supply system board, Inverter, converter board Ex: power conditioner and battery of the solar power
ApplianceLED lightings
Appliance
LED lightings
Paper phenolic circuit board materials Single-sided copper
clad : R-8700
  • Dimensional stability
  • Tracking resistance
  • Punching workability
  • Digital appliance, Home appliance, LED lightings, Power supply circuit