Circuit Board Materials



Major application Product name Product number Features / Proposals Detailed application
AutomotiveAntenna
Automotive
Antenna		 Multi-layer Circuit Board Materials for wireless/ RF communication equipment XPEDION
series		 Multi-layer circuit board materials that achieve low transmission losses in Radio Frequency range.
AutomotiveAntenna
Automotive
Antenna		 Halogen-free Ultra-low transmission loss Multi-layer Circuit board materials XPEDION1
New part number
Laminate :
R-5515X

Prepreg :
R-5410X

Existing part number
Laminate :
R-5515

Prepreg :
R-5410
  • Dk 3.06 Df 0.0021
    @14GHz
  • Tg (DMA) 200°C
  • Halogen-free
  • Antenna(Automotive millimeter-wave radar, Base station), etc.
AutomotiveAntenna
Automotive
Antenna		 High thermal conductivity Low transmission loss Halogen-free Multi-layer circuit board materials XPEDION T1
New part number
Laminate :
R-5575X

Prepreg :
R-5470X

Existing part number
Laminate :
R-5575

Prepreg :
R-5470
  • Dk 3.60 Df 0.0045
    @13GHz
  • Tg (DMA) 245°C
  • Thermal conductivity 0.60W/m･K
  • Power amplifier board(Base station for wireless communication, Small cell), Antenna(Base station), etc.
  • Antenna(Automotive millimeter-wave radar, Base station), etc.
ICT infrastructure equipment
ICT infrastructure
equipment		 Low transmission loss multi-layer materials MEGTRON
series		 Multi-layer circuit board materials suitable to large capacity and high speed transmission of high frequency signal
ICT infrastructure equipment
ICT infrastructure
equipment		 Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials MEGTRON8S
New part number
Laminate :
R-579YS(U)
R-579YS(N)

Prepreg :
R-569YS(U)
R-569YS(N)

Existing part number
Laminate :
R-5795S(U)
R-5795S(N)

Prepreg :
R-5690S(U)
R-5690S(N)
  • Dk 3.19 Df 0.0012
    @14GHz
  • Tg (DMA) 220°C
  • T288 (with copper)
    >120min.
  • Routers, switches, optical transmission equipment, servers, AI servers, base stations, semiconductor test equipment, probe cards, etc.
ICT infrastructure equipment
ICT infrastructure
equipment		 Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials MEGTRON8
New part number
Laminate :
R-579Y(U)
R-579Y(N)

Prepreg :
R-569Y(U)
R-569Y(N)

Existing part number
Laminate :
R-5795(U)
R-5795(N)

Prepreg :
R-5690(U)
R-5690(N)
  • Dk 3.08 Df 0.0012
    @14GHz
  • Tg (DMA) 220°C
  • T288 (with copper)
    >120min.
  • Routers, switches, optical transmission equipment, servers, AI servers, base stations, semiconductor test equipment, probe cards, etc.
ICT infrastructure equipment Aerospace
ICT infrastructure
equipment
Aerospace		 Ultra-low transmission loss multi-layer circuit board materials MEGTRON7
New part number
Laminate :
R-578Y(N)
R-578Y(GN)
R-578Y(GE)
R-578Y(R)*

Prepreg :
R-568Y(N)
R-568Y(GN)
R-568Y(GE)

Existing part number
Laminate :
R-5785(N)
R-5785(GN)
R-5785(GE)
R-5785(R)*

Prepreg :
R-5680(N)
R-5680(GN)
R-5680(GE)

*Buried Resistor
 Copper Foil
  • Dk 3.31 Df 0.0023
    @14GHz
  • Tg (DSC) 200°C
  • T288 (with copper)
    >120min.
  • High-end servers, High-end routers, Supercomputers, and other ICT infrastructure equipment, Antenna(Base station, Automotive millimeter-wave radar), etc.
ICT infrastructure equipment
ICT infrastructure
equipment		 Halogen-free Ultra-low transmission loss Multi-layer circuit board materials Halogen-fre MEGTRON6
New part number
Laminate :
R-537Y(N)
R-537Y(E)

Prepreg :
R-527Y(N)
R-527Y(E)

Existing part number
Laminate :
R-5375(N)
R-5375(E)

Prepreg :
R-5370(N)
R-5370(E)
  • Dk 3.36 Df 0.0029
    @13GHz
  • Tg (DMA) 250°C
  • T320 (with copper)
    >120min.
  • ICT infrastructure equipment, High speed networking(High-end server/ router, Optical network, switch), High layer count PCB, etc.
ICT infrastructure equipment Aerospace
ICT infrastructure
equipment
Aerospace		 Ultra-low transmission loss multi-layer circuit board materials MEGTRON6
Laminate :
R-5775(N)
R-5775(K)
R-5775(G)
R-5775(S)*
R-5775(R)*

Prepreg :
R-5670(N)
R-5670(K)
R-5670(G)

*Buried Resistor
 Copper Foil
  • High speed & ultra-low transmission loss
  • High reliability
  • Lead-free soldering
  • Networking equipment, Mainframe, IC tester, High frequency measuring device, Antenna(Base station, Automotive millimeter-wave radar), etc.
ICT infrastructure equipment
ICT infrastructure
equipment		 Low transmission loss multi-layer materials MEGTRON4S
MEGTRON4
Laminate :
R-5725S, R-5725
Prepreg :
R-5620S, R-5620
  • High speed & low transmission loss
  • High reliability
  • Lead-free soldering
  • Networking equipment(servers, routers), Measuring instruments, Antenna(Base station, Automotive millimeter-wave radar), etc.
ICT infrastructure equipment
ICT infrastructure
equipment		 Low transmission loss multi-layer materials MEGTRON M
Laminate : R-5735
Prepreg : R-5630
  • High speed & low transmission loss
  • High reliability
  • Lead-free soldering
  • Networking equipment (servers, routers), etc.
ICT infrastructure equipment
ICT infrastructure
equipment		 Low transmission loss multi-layer materials Halogen-free MEGTRON2
Laminate :
R-1577
Prepreg :
R-1570
  • High speed & low transmission loss
  • High heat resistance
  • Halogen free
  • Networking equipment(servers, routers), Measuring instruments, Automotive components, etc.
Automotive components
Automotive		 High heat resistance multi-layer materials HIPER
series		 Lineup of multi-layer circuit board materials with excellent high heat resistance and high reliability
ICT infrastructure equipment
ICT infrastructure
equipment		 High heat resistance (High-Tg) multi-layer circuit board materials HIPER V
Laminate : R-1755V
Prepreg : R-1650V
  • High heat resistance
  • High reliability
  • Low CTE
  • Networking equipment (servers, routers), Measuring instruments, Automotive components, etc.
Automotive components
Automotive		 High heat resistance (High-Tg) multi-layer circuit board materials HIPER D
Laminate : R-1755D
Prepreg : R-1650D
  • High heat resistance
  • High reliability
  • High reliability of solder connection
  • Engine room ECU (direct mounting to the engine)
Automotive components
Automotive		 High heat resistance (Middle-Tg) multi-layer circuit board materials HIPER M
Laminate : R-1755M
Prepreg : R-1650M
  • High heat resistance
  • High reliability
  • Low CTE
  • Automotive components (Engine room ECU), Electronic devices that require high reliability (use of lead-free solder), etc.
Automotive components
Automotive		 High heat resistance multi-layer circuit board materials HIPER E
Laminate : R-1755E
Prepreg : R-1650E
  • High heat resistance
  • High reliability
  • Low CTE
  • Automotive components (Engine room ECU), Electronic devices that require high reliability (use of lead-free solder), etc.
Automotive componentsMobile products
Automotive
Mobile products		 Halogen-free multi-layer circuit board materials Halogen-free
series		 Lineup of environment-friendly materials corresponding to the various application of mobile products.
Automotive componentsMobile products
Automotive
Mobile products		 Halogen-free multi-layer circuit board materials Halogen-free
Laminate :
R-1566, R-1566(W)
R-1566(WN)
Prepreg :
R-1551, R-1551(W)
R-1551(WN)
  • Halogen free
  • High reliability
  • Tracking resistance
    (CTI: 400V or more but less than 600V)
  • Automotive components, Mobile products(Mobile phone, Smart phone, Tablet PC, Digital camera), Antenna(Base station), etc.
Automotive components
Automotive		 High heat resistance halogen-free multi-layer circuit board materials Halogen-free
Laminate : R-1566S
Prepreg : R-1551S
  • High heat resistance Tg=175℃(DSC)
  • High reliability
  • Tracking resistance
    (CTI: More than 600V)
  • Engine Control Unit, etc.
Automotive componentsIndustry products
Automotive
Industry		 High CTI, High RTI Halogen-free multi-layer circuit board materials Halogen-free
Laminate : R-3566D
Prepreg : R-3551D
  • CTI≥600V*¹ PLC=0
    *¹ Measurement by ASTM method
  • FR-15.1 RTI 150°C*²
    *² 0.63mm or more
  • High voltage CAF resistance (1000V)
  • On Board Charger, DC/DC Converter, Inverter, In-Wheel Motor, etc.
  • EV Charging Stand, HV Control Unit, PV Module, etc.
Mobile productsAutomotive components
Mobile products
Automotive		 Low Dk halogen-free multi-layer circuit board materials Halogen-free
Laminate : R-A555(W)
Prepreg : R-A550(W)
  • Low Dk
  • Low CTE
  • High heat resistance
  • Mobile products(smartphone, tablet PC, digital camera, etc.)
  • In-vehicle autonomous driving server
Automotive components, etc. (many applications)
Automotive, etc.
(many applications)		 Glass epoxy multi-layer circuit board materials Laminate : R-1766
Prepreg : R-1661
  • Multilayer molding processability
  • Excellent laminate processability
  • Dimensional stability
  • Automotive components, Amusement, Digital appliance, Mobile product, Measuring instruments, Small and medium-sized computer, Semiconductor test equipment
Automotive components
Automotive
Power module		 High thermal conductive Bonding sheet New part number
R-14TY

Existing part number
R-14T1
  • High heat dissipation
  • Tracking resistance
  • Automotive Adhesive sheet application
Mobile products
Mobile products		 Flexible circuit board materials FELIOS
series		 We meet the diverse mounting needs of mobile products such as smartphones and digital appliances
Mobile products
Mobile products		 Flexible circuit board materials FELIOS
R-F775
  • Spring back performance
  • Dimensional stability
  • High heat resistance
  • Smartphone (Casing edge, Slide keyboard), DSCs (Camera module), LCD module, etc.
Mobile productsAutomotive components
Mobile products
Automotive		 LCP flexible circuit board materials FELIOS LCP
Double-sided copper
clad : R-F705S
  • Low transmission loss
  • High frequency characteristics
  • Moisture resistance
  • Smartphone(FPC Antenna(LTE, WiFi), LCD module), Networking equipment, Note PC·Tablet PC(High-speed FPC Cable), Antenna(Base station, Automotive millimeter-wave radar), etc.
Mobile products
Mobile products		 Low transmission loss flexible multi-layer circuit board materials Low Dk bonding
sheet : R-BM17
Core : R-F705
  • Thinner replacement of coaxial cable
  • Better handling at fabrication
  • Faster & lower loss for FPC cable
  • Antenna module for mobile product (Smartphone, tablet PC)　etc.
Mobile products
Mobile products		 Flexible circuit board materials resin coated copper foil FELIOS FRCC
Material for thinner,
multilayed : R-FR10
  • Can be multi-layered thin
  • Decrease a manufacture process
  • Halogen-free
  • Smartphone (Main board, Subboard, Module board), HDI board, etc.
AutomotiveAppliance
LED lightings
Automotive
Appliance
LED lightings		 Glass composite circuit board materials Circuit board materials which realize safety performance of the industry-leading and excellent cost performance by size-free manufacturing method.
Automotive componentsAppliance
Automotive
Appliance		 High reliability Glass composite circuit board materials Double-sided copper
clad : R-1785
  • CTE x, y-axis 20ppm/℃
  • Tg (TMA) 150℃
  • CTI≧600V
  • Automotive component, Power supply board, Power device module board, Infrastructure(Smart meter, IC tag), etc.
LED lightings
LED lightings		 High thermal conductive glass composite circuit board materials ECOOL
Double-sided :
R-1787
  • High heat dissipation
  • Tracking resistance
  • High reliability
  • LED back lights, LED lightings, Power Supply etc.
ApplianceAntenna
Appliance
Antenna		 Glass composite circuit board materials Double-sided copper
clad : R-1786
Single-sided copper
clad : R-1781
  • Tracking resistance
  • High reliability
  • Size-free
  • High frequency characteristics
  • Home appliance, Digital appliance, LED lighting, Meter panel, Power supply system board, Amusement machine, Antenna (5G terminal, equipment), etc.
Appliance / High current applications
Appliance
High current
applications		 Thick copper glass composite circuit board materials Double-sided copper
clad : R-1786
  • High current
    (Thick copper foil type)
  • Tracking resistance
  • High reliability
  • Power supply system board, Inverter, converter board Ex: power conditioner and battery of the solar power
Appliance
Appliance		 Paper Phenolic Circuit Board Materials Circuit board materials which is applied to the high-density packaging products by excellent electrical fire safety and dimensional stability.
Excellent tracking resistance.
Appliance
Appliance		 Paper phenolic circuit board materials
  • Dimensional stability
  • Tracking resistance
  • Punching workability
  • Digital appliance, Home appliance, Power supply circuit