Glass composite circuit board materials | R-1786, R-1781

Glass composite circuit board materials NewCEM-3


  1. Excellent tracking resistance (CTI ≥ 600V)
  2. Excellent insulation reliability (CAF resistance)
  3. Having excellent high frequency property
  4. Excellent board thickness accuracy

Circuit Board Materials

  • Part Number

copper clad

copper clad

  • Application
  • Detailed use
・For digital·home appliance
Inverter power supply system board, Air conditioner, Washing machine, Refrigerator, Power conditioner, Antenna circuit board, Etc.


Insulation reliability
Low dielectric property

Tracking resistance

Tracking resistance

CAF resistance

CAF resistance

Board thickness accuracy

Board thickness accuracy

General properties

Item Test method Condition Unit R-1786
Glass transition temp. (Tg) TMA Temp. rising rate: 10°C/min °C 140
Solder heat resistance JIS C6481 260°C solder float for 2min No abnormality
Heat resistance 1oz JIS C6481 A 240°C 60min
CTE x-axis α1 IPC-TM-650 2.4.41 TMA ppm/°C 25 (20)
CTE y-axis 28 (23)
CTE z-axis α1 IPC-TM-650 2.4.24 TMA ppm/°C 65
Dielectric constant (Dk) 1MHz IPC TM-650 C-96/20/65 4.5
C-96/20/65+D-24/23 4.5
Dissipation factor (Df) C-96/20/65 0.015
C-96/20/65+D-24/23 0.015
Volume resistivity JIS C6481 C-96/20/65 MΩ·m 1×108
C-96/20/65+C-96/40/90 5×107
Surface resistivity JIS C6481 C-96/20/65 3×108
C-96/20/65+C-96/40/90 1×108
Insulation resistance JIS C6481 C-96/20/65 5×108
C-96/20/65+D-2/100 1×107
Water absorption JIS C6481 E-24/50+D-24/23 % 0.08
Flexural strength Fill JIS C6481 A N/mm2 280
Peel strength 1/2oz JIS C6481 A kN/m 1.47
260°C solder float for 20sec 1.47
1oz JIS C6481 A 1.82
260°C solder float for 20sec 1.82
Alkali resistance JIS C6481 dipping (3min) No abnormality
Flammability JIS C6481 A+E-168/70 94V-0

The sample thickness is 1.6mm.
The figure in parentheses is for the thickness of 0.8mm.

The above data are typical values and not guaranteed values.