Flexible circuit board materials Resin coated copper foil FELIOS FRCC | R-FR10

Flexible circuit board materials resin coated copper foil FELIOS FRCC


  1. Possible to make board thinner and simplify the build-up process. Contribute to thinner and smaller of mobile product and module.

Circuit Board Materials

  • Part Number


  • Application
  • Detailed use
Smartphone(Main/Sub board, Module board), Etc.


Thinned multi-layer
Simplify the build-up process
Good coplanarity



Thin multi-layer

Thin multi-layer

General properties

Item Test method Condition Unit FELIOS FRCC
Glass transition temp.(Tg) Internal method(DMA) A °C 70,210(Ad) / 320(PI)
Internal method(TMA) A °C 190(Ad) / 270(PI)
CTE x, y-axis α1 Internal method(TMA) A ppm/°C 80(Ad) / 25(PI)
α2 580(Ad) / 25(PI)
CTE z-axis α1 Internal method(TMA) A ppm/°C 210(Ad) / - (PI)
α2 210(Ad) / - (PI)
Dielectric constant(Dk) 1GHz IPC-TM-650 A 3.0(Ad) / 3.3(PI)
2GHz 3.0(Ad) / 3.2(PI)
Dissipation factor(Df) 1GHz 0.019(Ad) / 0.010(PI)
2GHz 0.020(Ad) / 0.010(PI)
Solder heat resistance JIS C 6481 A No abnormality
260°C solder float for 1min.
Peel strength Copper:0.012mm(12μm) JIS C 6481 A N/mm 0.8
Volume resistivity JIS C 6481 C-96/20/65 MΩ·m 1×108
C-96/20/65+C-96/40/90 9×107
Surface resistance JIS C 6481 C-96/20/65 3×108
C-96/20/65+C-96/40/90 1×108
Water absorption Internal method E-24/50+D-24/23 % 1.2
Flammability UL A and E-168/70 94VTM-0*1
Alkali resistance Internal method Dipping 3minutes in 3%NaOH at 40°C No abnormality
Elastic modulus Internal method C-24/23/50 GPa 1.0(Ad) / 4.0(PI)
Bending property MIT*2 method 0.5kgφ0.38, 175cpm, 135° times >150

The sample thickness is Copper12μm, PI3μm, Ad17μm.
*1 Measured by R-FR10/R-F775 25μm/R-FR10 construction
*2 Measured 18μm ED copper on R-F775 25μm covered by R-FR10 for both side

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),

The above data are typical values and not guaranteed values.

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