Against the backdrop of the rapid digitization of vehicles, Panasonic provides devices best suited to customer's needs.
Search by application
Point the mouse cursor to the system that you are interested in and click to see detailed information.
In-Vehicle Server for Autonomous Driving
Tire Pressure Monitoring System (TPMS)
Detailed information about the automotive applications of relays, connectors, and switches is provided below.
Search by product category
Point the mouse cursor to the product that you are interested in and click the product name to see the product details.
Capacitors
- Conductive Polymer Aluminum Solid Capacitors (OS-CON)
- Conductive Polymer Hybrid Aluminum Electrolytic Capacitors
- Aluminum Electrolytic Capacitors (Surface Mount Type)
- Film Capacitors (Electronic Equipment Use)
- Film Capacitors (Automotive, Industrial and Infrastructure Use)
Resistors
- High Temperature Chip Resistors
- High Precision Chip Resistors
- Current Sensing Chip Resistors
- Small & High Power Chip Resistors
- Anti-Sulfurated Chip Resistors
Inductors
Thermal Management Solutions
- Thermal conductive sheet PGS Graphite Sheet(GraphiteTIM)
- NTC Thermistor (Chip type)
- Cooling Fan with Unique Hydro Dynamic Bearing
EMC Components
Circuit Protection
Sensors
Input Devices
Relays
Connectors
- Automotive Connector
- FPC/FFC Connector(Y5B/Y5BW)
- Narrow Pitch Connector for board to board(P4S)
- Narrow Pitch Connector for board to board (P5K/P5KS)
Batteries (for Business)
Electronic Materials
- Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials MEGTRON8
- Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON7
- Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON6
- Halogen-free Ultra-low transmission loss Multi-layer Circuit board materials XPEDION1
- Highly heat resistant Low CTE Multi-layer circuit board materials <High-Tg type> HIPER D
- Highly heat resistant Low CTE Multi-layer circuit board materials <Middle-Tg type> HIPER M
- Highly heat resistant Low CTE Multi-layer circuit board materials HIPER E
- High thermal conductivity Glass composite circuit board materials ECOOL
- Flexible circuit board materials FELIOS
- Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP
- Low Dk Highly heat resistant Halogen-free Multi-layer circuit board materials
- Mass laminations(Shield board) "PreMulti"
- High reliability Glass composite Circuit board materials
- High heat resistance Secondary mounting Sidefill materials
- High heat resistance Secondary mounting Underfill materials
- Low-temperature curing Secondary mounting Underfill materials
- For secondary mounting reinforcement drop impact resistance liquid encapsulant
- For power modules high thermal conductive semiconductor encapsulation materials
- For high heat resistance power devices semiconductor encapsulation materials
- For LED (optical parts) light diffusion/reflection PP molding compounds FULL BRIGHT PP
- High heat resistance Phenolic Molding Compound for Automotive Components
- Long-term reliable PBT Molding Compound for Automotive Components
- Anti-Glare Type Anti-Reflection Films
- Clear Type Anti-Reflection Films
- Moldable Low-Reflection Films
- Anti-Rainbow and Anti-Blackout Films
- Thermal Insulation Optical Films