Semiconductor Package

Panasonic provides electronic materials best suited to customer needs, including circuit board materials and sealing materials for large and narrow-pitch semiconductor packages, as well as liquid materials and adhesives for mounting reinforcement.

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Related Use Case

BGA Encapsulation/Mounting
FC-BGA Application processor
Application processor
CSP Memory
Encapsulation/Mounting
FC-CSP Application processor
PoP, MUF Encapsulation/Mounting
NCP, CUF Encapsulation/Mounting
Surface Mount Assembly Reinforcement Sidefill
Underfill
Underfill
Sidefill/Underfill
Large Encapsulation Area Encapsulation/Mounting
Module Encapsulation Automotive power module / Inverter module
SiC power module / Inverter module