- Good highly heat resistant property as general materials apply to Automotive component in harsh environment, high voltage and Industry application.
Circuit Board Materials
- Part Number
Laminate R-1755E
Prepreg R-1650E
- Application
- Detailed use
・Automotive
・Industry
・Industry
Automotive component (ECU board, GPS navigation system), Electric car, Industry, Appliance, etc.
Properties
Tg (DSC)
133℃
133℃
Td (TGA)
370℃
370℃
CTE z-axis
42ppm/℃
42ppm/℃
Positioning of Glass transition temperature(Tg)
Through-hole reliability
Insulation reliability
General properties
| Item | Test method | Condition | Unit | HIPER E R-1755E |
Conventional FR-4 R-1766 |
|
|---|---|---|---|---|---|---|
| Glass transition temp (Tg) | DSC | A | °C | 133 | 140 | |
| Thermal decomposition temp (Td) | TG/DTA | A | °C | 370 | 315 | |
| CTE x-axis | α1 | IPC TM-650 2.4.41 | A | ppm/°C | 11-13 | 11-13 |
| CTE y-axis | 13-15 | 13-15 | ||||
| CTE z-axis | α1 | IPC TM-650 2.4.24 | A | 42 | 65 | |
| α2 | 250 | 270 | ||||
| T288 (with copper) | IPC TM-650 2.4.24.1 | A | min | 25 | 1 | |
| Dielectric constant (Dk) | 1GHz | IPC TM-650 2.5.5.9 | C-24/23/50 | – | 4.6 | 4.3 |
| Dissipation factor (Df) | 0.013 | 0.016 | ||||
| Water absorption | IPC TM-650 2.6.2.1 | D-24/23 | % | 0.11 | 0.14 | |
| Flexural modulus | Warp | JIS C6481 | A | GPa | 24 | 23 |
| Fill | 22 | 21 | ||||
| Peel strength | 1oz | IPC TM-650 2.4.8 | A | kN/m | 1.6 | 2.0 |
The sample thickness is 0.8mm.
The above data are typical values and not guaranteed values.
