In the AV and Computing fields where progress is being made to achieve the downsizing and reduced weight of equipment, Panasonic provides devices best suited to customer's needs.
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- Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap)
- Conductive Polymer Tantalum Solid Capacitors (POSCAP)
- Conductive Polymer Aluminum Solid Capacitors (OS-CON)
- Conductive Polymer Hybrid Aluminum Electrolytic Capacitors
- Film Capacitors (Electronic Equipment Use)
Thermal Management Solutions
- Narrow Pitch Connector for board to FPC
- High Current Connectors
- FPC/FFC Connector
- Narrow Pitch Connector for board to board
Batteries (for Business)
- Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP
- Flexible circuit board materials Resin coated copper foil FELIOS FRCC
- Halogen-free Multi-layer circuit board materials
- Low Dk Highly heat resistant Halogen-free Multi-layer circuit board materials
- Mass laminations(Shield board) "PreMulti"
- Glass composite circuit board materials
- Capillary Underfill(CUF) Semiconductor encapsulation materials
- Thin surface mounting semiconductor encapsulation materials
- For SMD module low warpage liquid encapsulant
- High elasticity Low CTE Ultra-thin IC substrate materials
- For secondary mounting reinforcement drop impact resistance liquid encapsulant
- Thermosetting Adhesive / UV curing Adhesive
- Anti-Glare Type Anti-Reflection Films
- Clear Type Anti-Reflection Films
- Moldable Low-Reflection Films
- Anti-Rainbow and Anti-Blackout Films