Information and Communication Infrastructure Solutions

Main devices supporting information and communication infrastructure

Base stations handle the radio aspects of information and communication infrastructure. They are composed of remote radio heads (RRHs), radio units (RUs), distributed units (DUs), central units (CUs), edge servers, and so forth. The backhaul that relays data from base stations uses equipment such as switches, routers, communication servers, wavelength division multiplexing (WDM), and optical transmission network systems (OTNs). Data centers are equipped with devices such as AI servers and storage.

Main devices supporting information and communication infrastructure

Technology trends for information and communication infrastructure

Base stations are adopting AI chips to drive edge computing, which requires low latency and high-speed responsiveness. For data centers, the demand is for even faster server processing through AI servers. Panasonic Industry provides optimal solutions such as compact, highly reliable, low-loss, and heat-resistant components and materials essential for realizing the next generation of evolving information and communication infrastructure equipment.

Technology trends for information and communication infrastructure

Information and Communication Infrastructure Solutions

■Solutions for data centers (AI servers)

■Product introduction videos

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Solutions for data centers (AI servers) Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap) Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap) Conductive Polymer Tantalum Solid Capacitors (POSCAP) Conductive Polymer Tantalum Solid Capacitors (POSCAP) Conductive Polymer Aluminum Solid Capacitors (OS-CON) Conductive Polymer Aluminum Solid Capacitors (OS-CON) Conductive Polymer Hybrid Aluminum Electrolytic Capacitors Conductive Polymer Hybrid Aluminum Electrolytic Capacitors PhotoMOS PhotoMOS Power Relays(Over 2A) Power Relays(Over 2A) Signal Relays(2A or less) Signal Relays(2A or less) Resistors Resistors Multi-layer Circuit Board Materials MEGTRON Multi-layer Circuit Board Materials MEGTRON IC Substrate Materials LEXCM GX IC Substrate Materials LEXCM GX Liquid Materials for Underfill LEXCM DF Liquid Materials for Underfill LEXCM DF Semiconductor Packaging Encapsulation Materials LEXCM CF Semiconductor Packaging Encapsulation Materials LEXCM CF Thermal conductive sheet PGS Graphite Sheet (Graphite TIM) Thermal conductive sheet PGS Graphite Sheet (Graphite TIM) Cooling Fan with Unique Hydro Dynamic Bearing Cooling Fan with Unique Hydro Dynamic Bearing
Solutions for data centers (AI servers) Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap) Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap) Conductive Polymer Tantalum Solid Capacitors (POSCAP) Conductive Polymer Tantalum Solid Capacitors (POSCAP) Conductive Polymer Aluminum Solid Capacitors (OS-CON) Conductive Polymer Aluminum Solid Capacitors (OS-CON) Conductive Polymer Hybrid Aluminum Electrolytic Capacitors Conductive Polymer Hybrid Aluminum Electrolytic Capacitors PhotoMOS PhotoMOS Power Relays(Over 2A) Power Relays(Over 2A) Signal Relays(2A or less) Signal Relays(2A or less) Resistors Resistors Multi-layer Circuit Board Materials MEGTRON Multi-layer Circuit Board Materials MEGTRON IC Substrate Materials LEXCM GX IC Substrate Materials LEXCM GX Liquid Materials for Underfill LEXCM DF Liquid Materials for Underfill LEXCM DF Semiconductor Packaging Encapsulation Materials LEXCM CF Semiconductor Packaging Encapsulation Materials LEXCM CF Thermal conductive sheet PGS Graphite Sheet (Graphite TIM) Thermal conductive sheet PGS Graphite Sheet (Graphite TIM) Cooling Fan with Unique Hydro Dynamic Bearing Cooling Fan with Unique Hydro Dynamic Bearing

■Liquid-cooling (water-cooling) solutions for AI servers

■Product introduction videos

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Liquid-cooling (water-cooling) solutions for AI servers Thermal conductive sheet PGS Graphite Sheet (Graphite TIM) Thermal conductive sheet PGS Graphite Sheet (Graphite TIM) Pressure Sensors Pressure Sensors Motors for Air Conditioning Motors for Air Conditioning
Liquid-cooling (water-cooling) solutions for AI servers Thermal conductive sheet PGS Graphite Sheet (Graphite TIM) Thermal conductive sheet PGS Graphite Sheet (Graphite TIM) Pressure Sensors Pressure Sensors Motors for Air Conditioning Motors for Air Conditioning

■Solutions for backhaul (digital core units)

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Solutions for backhaul (digital core units) Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap) Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap) Conductive Polymer Tantalum Solid Capacitors (POSCAP) Conductive Polymer Tantalum Solid Capacitors (POSCAP) Conductive Polymer Aluminum Solid Capacitors (OS-CON) Conductive Polymer Aluminum Solid Capacitors (OS-CON) Conductive Polymer Hybrid Aluminum Electrolytic Capacitors Conductive Polymer Hybrid Aluminum Electrolytic Capacitors PhotoMOS PhotoMOS Signal Relays(2A or less) Signal Relays(2A or less) Resistors Resistors Liquid Materials for Underfill LEXCM DF Liquid Materials for Underfill LEXCM DF Semiconductor Packaging Encapsulation Materials LEXCM CF Semiconductor Packaging Encapsulation Materials LEXCM CF Multi-layer Circuit Board Materials MEGTRON Multi-layer Circuit Board Materials MEGTRON Thermal conductive sheet PGS Graphite Sheet (Graphite TIM) Thermal conductive sheet PGS Graphite Sheet (Graphite TIM) Cooling Fan with Unique Hydro Dynamic Bearing Cooling Fan with Unique Hydro Dynamic Bearing
Solutions for backhaul (digital core units) Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap) Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap) Conductive Polymer Tantalum Solid Capacitors (POSCAP) Conductive Polymer Tantalum Solid Capacitors (POSCAP) Conductive Polymer Aluminum Solid Capacitors (OS-CON) Conductive Polymer Aluminum Solid Capacitors (OS-CON) Conductive Polymer Hybrid Aluminum Electrolytic Capacitors Conductive Polymer Hybrid Aluminum Electrolytic Capacitors PhotoMOS PhotoMOS Signal Relays(2A or less) Signal Relays(2A or less) Resistors Resistors Liquid Materials for Underfill LEXCM DF Liquid Materials for Underfill LEXCM DF Semiconductor Packaging Encapsulation Materials LEXCM CF Semiconductor Packaging Encapsulation Materials LEXCM CF Multi-layer Circuit Board Materials MEGTRON Multi-layer Circuit Board Materials MEGTRON Thermal conductive sheet PGS Graphite Sheet (Graphite TIM) Thermal conductive sheet PGS Graphite Sheet (Graphite TIM) Cooling Fan with Unique Hydro Dynamic Bearing Cooling Fan with Unique Hydro Dynamic Bearing

■Solutions for base stations (antennas / Massive MIMO / radio units)

Click a product to view detailed information.

Solutions for base stations (antennas / Massive MIMO / radio units) Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap) Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap) Conductive Polymer Tantalum Solid Capacitors (POSCAP) Conductive Polymer Tantalum Solid Capacitors (POSCAP) Conductive Polymer Aluminum Solid Capacitors (OS-CON) Conductive Polymer Aluminum Solid Capacitors (OS-CON) Conductive Polymer Hybrid Aluminum Electrolytic Capacitors Conductive Polymer Hybrid Aluminum Electrolytic Capacitors Transparent Conductive Film FineX Transparent Conductive Film FineX Resistors Resistors High frequency circuit board materials XPEDION High frequency circuit board materials XPEDION Flexible Circuit Board Materials FELIOS Flexible Circuit Board Materials FELIOS Multi-layer Circuit Board Materials MEGTRON Multi-layer Circuit Board Materials MEGTRON Liquid Materials for Underfill LEXCM DF Liquid Materials for Underfill LEXCM DF Thermal conductive sheet PGS Graphite Sheet (Graphite TIM) Thermal conductive sheet PGS Graphite Sheet (Graphite TIM)
Solutions for base stations (antennas / Massive MIMO / radio units) Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap) Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap) Conductive Polymer Tantalum Solid Capacitors (POSCAP) Conductive Polymer Tantalum Solid Capacitors (POSCAP) Conductive Polymer Aluminum Solid Capacitors (OS-CON) Conductive Polymer Aluminum Solid Capacitors (OS-CON) Conductive Polymer Hybrid Aluminum Electrolytic Capacitors Conductive Polymer Hybrid Aluminum Electrolytic Capacitors Transparent Conductive Film FineX Transparent Conductive Film FineX Resistors Resistors High frequency circuit board materials XPEDION High frequency circuit board materials XPEDION Flexible Circuit Board Materials FELIOS Flexible Circuit Board Materials FELIOS Multi-layer Circuit Board Materials MEGTRON Multi-layer Circuit Board Materials MEGTRON Liquid Materials for Underfill LEXCM DF Liquid Materials for Underfill LEXCM DF Thermal conductive sheet PGS Graphite Sheet (Graphite TIM) Thermal conductive sheet PGS Graphite Sheet (Graphite TIM)