Semiconductor Encapsulation Materials, Adhesives

Major application Product name Product number Features / Proposals Detailed application
IC package
IC package
Semiconductor Packaging Encapsulation Materials for Advanced Package Contribute to improving the reliability of advanced semiconductor package such as wafer level package, FC CSP/BGA, Wifi module, etc.
IC packageMobile products
IC package
Mobile products
Encapsulation Materials for FOWLP/PLP LEXCM CF
LEXCM SF
LEXCM LF
CV8511C
CV2308
CV5788
  • Low stress
  • Low shrinkage
  • Low temp.curability
Over-molding and wafer back-coating of advanced semiconductor packages, such as WLPs (FOWLPs and FIWLPs) and PLPs, for sophisticated mobile and wearable devices
IC packageMobile products
IC package
Mobile products
Molded Underfill(MUF) Semiconductor encapsulation Molding compounds LEXCM CF CV8710
CV8713
  • Saving process time
  • for Narrow gap/pitch
  • Low warpage
Advanced IC Packages(Flip-chip package such as FC-CSP, FC-SiP module, etc.)
IC packageMobile products
IC package
Mobile products
Capillary Underfill(CUF) Semiconductor encapsulation materials LEXCM LF CV5300
CV5350
  • High fluidity
  • for Narrow gap/pitch
  • Reduced void/bleed
High-density Advanced IC Packages(BGA, CSP, etc.)
IC package
IC package
Thin surface mounting semiconductor encapsulation materials LEXCM CF CV8710
CV8760
  • Thinner
  • High-density wiring
  • Warpage control
High-density, advanced package for mobile devices(PoP,MCP,Mold underfill package, etc.)
IC package
IC package
For SMD module low warpage liquid encapsulant LEXCM LF CV5386
CV5401
  • Warpage control
  • High adhesion
  • Reduced solder flash
Communication module (MAP, COB) for mobile devices such as notebook PC, digital camera, mobile phone, smartphone, tablet PC.
IC package
IC package
Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment Contribute to improving the reliability of semiconductor package such as a power device requiring automotive quality
IC packageAutomotive components
IC package
Automotive components
For Automotive IC package Delamination free surface mounting semiconductor encapsulation materials LEXCM CF CV8213
series
  • High adhesion, low stress
  • AEC-Q100/grade 0
  • for Clip-bond PKG
Surface mounting PKG: SOP, QFP, LQFP, DPAK, LFPAK, TOLL
IC package
IC package
For power modules high thermal conductive semiconductor encapsulation materials LEXCM CF CV4180
CV4380
  • High heat dissipation
  • Stress reduction
  • High adhesion
Inverter module for major appliances and industrial motors, Automotive module
IC package
IC package
For high heat resistance power devices semiconductor encapsulation materials LEXCM CF CV8540
series
  • High heat resistance
  • Low warpage, Low stress
  • High insulation
Power devices used in industry/Automotive inverters
IC package
IC package
Potting material LEXCM GF CV5000
series
  • Low stress
  • High adhesion
Potting, Casting, etc.
IC package
IC package
Liquid Materials for Board level Underfill, Adhesives Secondary mounting reinforcement of semiconductor package such as CSP/BGA, Adhesive bonding of camera module/image sensor
IC packageAutomotive components
IC package
Automotive components
High heat resistance Secondary mounting Sidefill materials LEXCM AF CV5797
series
  • For large size PKG
  • Tg 160°C
  • Pot life: 72h
Surface mounting PKG: CSP, BGA, WLCSP, QFN, MLCC, Image sensor, etc.
IC packageAutomotive components
IC package
Automotive components
High heat resistance Secondary mounting Underfill materials LEXCM AF CV5794
series
  • Tg 160°C
  • Compatible with the PKG size up to 20 mm square
  • Pot life: 72h
Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU
IC packageAutomotive components
IC package
Automotive components
Low-temperature curing Secondary mounting Underfill materials LEXCM AF CV5350AS
  • Cures at a low temp of 80°C
  • Tg is 140°C or greater
Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU, etc.
IC package
IC package
For secondary mounting reinforcement drop impact resistance liquid encapsulant LEXCM AF CV5313
CV5314
  • Drop impact resistance
  • Underfill/Sidefill reinforcement
LSI package and SSD for mobile devices such as notebook PC, digital camera, mobile phones, smartphone and tablet PC.
IC package
IC package
Thermosetting/UV curing Adhesives LEXCM GF CV5000
CV7000
series
  • Bonding of various materials
  • Solvent resistance
  • Time-lagged curing
Image Sensor, etc.