Semiconductor Device Materials

Contribute to IC substrates as thinner and smaller and low warpage.

Major application	Product name	Product number	Features / Proposals	Detailed application
IC package	Narrow pitch corresponding circuit board materials	series	Contribute to IC substrates as thinner and smaller and low warpage
IC package	Ultra-low transmission loss Circuit board materials for IC substrate/Module	Laminate : R-G545L, R-G545E Prepreg : R-G540L, R-G540E	Df 0.003 Dk 3.5@12GHz CTE x, y-axis 10ppm/°C Tg (DMA) 230°C	IC PKG for base station application, Module part, etc.
IC package	Low CTE Ultra-thin IC substrate materials	Laminate : R-G515S, R-G515E Prepreg : R-G510S, R-G510E	CTE x,y-axis 4-6ppm/°C (Low CTE glass cloth) Low warpage Ultra-thin, Excellent moldability	IC substrate CSP (PoP-Bottom, Flip-Chip, Memory, Module, etc.)
IC package	Low CTE IC substrate materials Designed to Improve Reliability	Laminate : R-1515V,R-1515K	CTE x, y-axis 3-5ppm/°C (Low CTE glass cloth) Stress Relaxation Good Thickness Variation	IC substrate FC-BGA (CPU, GPU, FPGA, ASIC, etc.)
IC package	Narrow pitch corresponding circuit board materials	Laminate : R-1515W Prepreg : R-1410W	High heat resistance Low CTE Mechanical drilling-ability	FC-BGA
IC package	Narrow pitch corresponding circuit board materials	Laminate : R-1515A Prepreg : R-1410A	High heat resistance Mechanical drilling-ability Halogen-free	FC-BGA
IC package	Ultra-thin circuit board materials	Laminate : R-151YE Prepreg : R-141YE Laminate : R-1515E Prepreg : R-1410E	Low warpage Corresponding to ultra-thin Halogen-free	CSP

Contribute to improving the reliability of advanced semiconductor package such as wafer level package, FC CSP/BGA, Wifi module, etc.

Major application	Product name	Product number	Features / Proposals	Detailed application
IC package	Semiconductor Packaging Encapsulation Materials for Advanced Package		Contribute to improving the reliability of advanced semiconductor package such as wafer level package, FC CSP/BGA, Wifi module, etc.
IC package Mobile products	Encapsulation Materials for FOWLP/PLP	CV8511CUB	Low stress Low shrinkage Low temp.curability	Over-molding and wafer back-coating of advanced semiconductor packages, such as WLPs (FOWLPs and FIWLPs) and PLPs, for sophisticated mobile and wearable devices
IC package Mobile products	Molded Underfill(MUF) Semiconductor encapsulation Molding compounds	CV8581 CV8713	Saving process time for Narrow gap/pitch Low warpage	Advanced IC Packages(Flip-chip package such as FC-CSP, FC-SiP module, etc.)
IC package Mobile products	Capillary Underfill(CUF) Semiconductor encapsulation materials	CV5300 series	High fluidity for Narrow gap/pitch Reduced void/bleed	High-density Advanced IC Packages(BGA, CSP, etc.)
IC package	Thin surface mounting semiconductor encapsulation materials	CV8710 CV8760	Thinner High-density wiring Warpage control	High-density, advanced package for mobile devices(PoP,MCP,Mold underfill package, etc.)
IC package	For SMD module low warpage liquid encapsulant	CV5386 CV5401	Warpage control High adhesion Reduced solder flash	Communication module (MAP, COB) for mobile devices such as notebook PC, digital camera, mobile phone, smartphone, tablet PC.

Contribute to improving the reliability of semiconductor package such as a power device requiring automotive quality

Major application	Product name	Product number	Features / Proposals	Detailed application
IC package	Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment		Contribute to improving the reliability of semiconductor package such as a power device requiring automotive quality
IC package Automotive components	For Automotive IC package Delamination free surface mounting semiconductor encapsulation materials	CV8213 series	High adhesion, low stress AEC-Q100/grade 0 for Clip-bond PKG	Surface mounting PKG: SOP, QFP, LQFP, DPAK, LFPAK, TOLL
IC package	For power modules high thermal conductive semiconductor encapsulation materials	CV4180 CV4380	High heat dissipation Stress reduction High adhesion	Inverter module for major appliances and industrial motors, Automotive module
IC package	For high heat resistance power devices semiconductor encapsulation materials	CV8540 series	High heat resistance Low warpage, Low stress High insulation	Power devices used in industry/Automotive inverters

Secondary mounting reinforcement of semiconductor package such as CSP/BGA, Adhesive bonding of camera module/image sensor

Major application	Product name	Product number	Features / Proposals	Detailed application
IC package	Liquid Materials for Board level Underfill		Secondary mounting reinforcement of semiconductor package such as CSP/BGA, Adhesive bonding of camera module/image sensor
IC package Automotive components	High heat resistance Secondary mounting Sidefill materials	CV5797 series	For large size PKG Tg 160°C Pot life: 72h	Surface mounting PKG: CSP, BGA, WLCSP, QFN, MLCC, Image sensor, etc.
IC package Automotive components	High heat resistance Secondary mounting Underfill materials	CV5794 series	Tg 160°C Compatible with the PKG size up to 20mm square Pot life: 72h	Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU
IC package Automotive components	Low-temperature curing Secondary mounting Underfill materials	CV5350AS	Cures at a low temp of 80°C Tg is 140°C or greater	Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU, etc.
IC package	For secondary mounting reinforcement drop impact resistance liquid encapsulant	CV5313 CV5314	Drop impact resistance Underfill/Sidefill reinforcement	LSI package and SSD for mobile devices such as notebook PC, digital camera, mobile phones, smartphone and tablet PC.