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Major application | Product name | Product number | Features / Proposals | Detailed application | |
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Narrow pitch corresponding circuit board materials | ![]() series |
Contribute to IC substrates as thinner and smaller and low warpage | ||
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Ultra-low transmission loss Circuit board materials for IC substrate/Module | ![]() Laminate : R-G545L, R-G545E Prepreg : R-G540L, R-G540E |
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Low CTE Ultra-thin IC substrate materials | ![]() Laminate : R-G515S, R-G515E Prepreg : R-G510S, R-G510E |
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Low CTE IC substrate materials Designed to Improve Reliability | ![]() Laminate : R-1515V,R-1515K |
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Narrow pitch corresponding circuit board materials | ![]() Laminate : R-1515W Prepreg : R-1410W |
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Narrow pitch corresponding circuit board materials | ![]() Laminate : R-1515A Prepreg : R-1410A |
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Ultra-thin circuit board materials | ![]() ![]() Laminate : R-151YE Prepreg : R-141YE ![]() Laminate : R-1515E Prepreg : R-1410E |
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Semiconductor Encapsulation Materials
Semiconductor Packaging Encapsulation Materials for Advanced Package
Contribute to improving the reliability of advanced semiconductor package such as wafer level package, FC CSP/BGA, Wifi module, etc.
Major application | Product name | Product number | Features / Proposals | Detailed application | |
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Semiconductor Packaging Encapsulation Materials for Advanced Package | Contribute to improving the reliability of advanced semiconductor package such as wafer level package, FC CSP/BGA, Wifi module, etc. | |||
![]() ![]() IC package Mobile products |
Encapsulation Materials for FOWLP/PLP | ![]() CV8511CUB |
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Over-molding and wafer back-coating of advanced semiconductor packages, such as WLPs (FOWLPs and FIWLPs) and PLPs, for sophisticated mobile and wearable devices | |
![]() ![]() IC package Mobile products |
Molded Underfill(MUF) Semiconductor encapsulation Molding compounds | ![]() CV8581 CV8713 |
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Advanced IC Packages(Flip-chip package such as FC-CSP, FC-SiP module, etc.) | |
![]() ![]() IC package Mobile products |
Capillary Underfill(CUF) Semiconductor encapsulation materials | ![]() CV5300 series |
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High-density Advanced IC Packages(BGA, CSP, etc.) | |
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Thin surface mounting semiconductor encapsulation materials | ![]() CV8710 CV8760 |
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High-density, advanced package for mobile devices(PoP,MCP,Mold underfill package, etc.) | |
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For SMD module low warpage liquid encapsulant | ![]() CV5386 CV5401 |
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Communication module (MAP, COB) for mobile devices such as notebook PC, digital camera, mobile phone, smartphone, tablet PC. |
Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment
Contribute to improving the reliability of semiconductor package such as a power device requiring automotive quality
Major application | Product name | Product number | Features / Proposals | Detailed application | |
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Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment | Contribute to improving the reliability of semiconductor package such as a power device requiring automotive quality | |||
![]() ![]() IC package Automotive components |
For Automotive IC package Delamination free surface mounting semiconductor encapsulation materials | ![]() CV8213 series |
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Surface mounting PKG: SOP, QFP, LQFP, DPAK, LFPAK, TOLL | |
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For power modules high thermal conductive semiconductor encapsulation materials | ![]() CV4180 CV4380 |
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Inverter module for major appliances and industrial motors, Automotive module | |
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For high heat resistance power devices semiconductor encapsulation materials | ![]() CV8540 series |
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Power devices used in industry/Automotive inverters |
Liquid Materials for Board level Underfill
Secondary mounting reinforcement of semiconductor package such as CSP/BGA, Adhesive bonding of camera module/image sensor
Major application | Product name | Product number | Features / Proposals | Detailed application | |
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Liquid Materials for Board level Underfill | Secondary mounting reinforcement of semiconductor package such as CSP/BGA, Adhesive bonding of camera module/image sensor | |||
![]() ![]() IC package Automotive components |
High heat resistance Secondary mounting Sidefill materials | ![]() CV5797 series |
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Surface mounting PKG: CSP, BGA, WLCSP, QFN, MLCC, Image sensor, etc. | |
![]() ![]() IC package Automotive components |
High heat resistance Secondary mounting Underfill materials | ![]() CV5794 series |
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Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU | |
![]() ![]() IC package Automotive components |
Low-temperature curing Secondary mounting Underfill materials | ![]() CV5350AS |
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Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU, etc. | |
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For secondary mounting reinforcement drop impact resistance liquid encapsulant | ![]() CV5313 CV5314 |
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LSI package and SSD for mobile devices such as notebook PC, digital camera, mobile phones, smartphone and tablet PC. |