Zoom
Contribute to improving the reliability of semiconductor package
such as a power device requiring automotive quality
such as a power device requiring automotive quality
Semiconductor Encapsulation Materials/Adhesive
- For Automotive IC package Delamination free
surface mounting semiconductor encapsulation materials CV8213 - For Power modules High thermal conductive
semiconductor encapsulation materials CV4180, CV4380 - For high heat resistance power devices
semiconductor encapsulation materials CV8540 - Potting material CV5000
New branding announcement
-
Panasonic Electronic Materials Division launches LEXCM brand Semiconductor Device Materials. The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials (which includes substrates, encapsulants and underfills) and electronic assembly materials. Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.
Line up
| Application | Our oroposal |
|---|---|
Power device |
High adhesion, low stress AEC-Q100/grade 0 for Clip-bond PKG |
|
For Power modules High thermal conductive High heat dissipation Stress reduction High adhesion |
|
|
For high heat resistance power devices High heat resistance Low warpage, Low stress High insulation |
|
Potting/Casting |
Potting material CV5000 Low stress High adhesion
|
