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Contribute to improving the reliability of semiconductor package
such as a power device requiring automotive quality
such as a power device requiring automotive quality
Semiconductor Encapsulation Materials
- For Automotive IC package　Delamination free
surface mounting semiconductor encapsulation materials CV8213 - For Power modules High thermal conductive
semiconductor encapsulation materials CV4180, CV4380 - For high heat resistance power devices
semiconductor encapsulation materials CV8540
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| Application | Our oroposal |
|---|---|
Power device |
For Automotive IC package　Delamination free High adhesion, low stress AEC-Q100/grade 0 for Clip-bond PKG |
|
For Power modules High thermal conductive High heat dissipation Stress reduction High adhesion |
|
|
For high heat resistance power devices High heat resistance Low warpage, Low stress High insulation |
