Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM LF" series

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Contribute to improving the reliability of advanced semiconductor package
such as wafer level package, FC CSP/BGA, Wifi module, etc.

New branding announcement

  • Panasonic Electronic Materials Division launches LEXCM brand Semiconductor Device Materials. The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials (which includes substrates, encapsulants and underfills) and electronic assembly materials. Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.

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Application Our proposal
WLP/PLP
WLP/PLP

Encapsulation Materials for FOWLP/PLP CV8511C, CV2308, CV5791

Low stress Low shrinkage Low temp.curability

FC CSP / FC BGA
FC CSP

Molded Underfill(MUF) Semiconductor encapsulation Molding compounds CV8710

Saving process time for Narrow gap/pitch Low warpage

Capillary Underfill(CUF) Semiconductor encapsulation materials CV5300, CV5350

High fluidity for Narrow gap/pitch Reduced void/bleed

Thin surface mounting Semiconductor encapsulation materials CV8710, CV8760

Thinner High-density wiring Warpage control

Wifi module
Wifi module

For SMD module low warpage liquid encapsulant CV5386, CV5401

Warpage control High adhesion Reduced solder flash

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