5G Multilayer PCB Solutions

5G Network Architecture

Governments and private industry are working together to develop 5th generation(5G) mobile communication systems by designing network architectures capable of delivering "enhanced Mobile Broadband” (eMBB), "Ultra Reliable Low Latency Communications” (URLLC) and "massive Machine Type Communications” (mMTC). While 4G systems use frequencies in the 700MHz to 3.5GHz range, 5G functions in higher frequency bands. 5G architecture employs macrocell base stations operating sub-6GHz bands (like 3.7 GHz and 4.5GHz) to cover wide areas in combination with smaller base stations running in the millimeter wave band to provide local coverage.

Massive MIMO Technology

4G base stations emit their radio waves in all directions while 5G base stations employ "Beamforming" technology which uses multi-element antennas to form sharply focused beams.
This architecture supports “Massive Multi-Input Multi-Output” (MIMO) which enables simultaneous communication with multiple devices and greatly expands network coverage capability.

5G Multilayer PCB Solutions

Because 5G uses higher frequencies, low transmission loss circuit board materials are required. Panasonic has created a suite of Multilayer Circuit Board Materials that enable high-speed, low transmission loss designs by combining innovative resin systems with low-roughness copper foil bonding technology.
Panasonic low-loss PCB materials also exhibit superior workability which supports the requirements of leading-edge super multi-element antennas. This is important because ‘Multilayering” enables highly efficient integrated modules in which the antenna and the RF chip are on the same board.
To support product development, Panasonic has developed a unique modelling technology that can be applied for PCB materials up to 110GHz.

PCB WEST 2020
Online Impedance Simulator

Panasonic introduces an innovative test methodology for accurately characterizing PCB materials for high-speed communication system designs.

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PRODUCT INQUIRIES

Panasonic Low Transmission Loss,
Highly Temperature Resistant Multilayer Circuit Board Materials Product Guide

Panasonic’s Lowest Loss Material
R-5515 Halogen-Free, Ultra Low Transmission Loss Circuit Board Material

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Low Transmission Loss Multi-layer Circuit Board Materials

Item Test
method
Condition Unit MEGTRON7 MEGTRON6 MEGTRON4
R-5725
MEGTRON4S
R-5725S
MEGTRON M
R-5735
MEGTRON2
R-1577
HIPER V
R-1755V
R-5785(N) R-5785 R-5775(N) R-5775
Glass transition
temperature
(Tg)
DSC A °C 200 200 185 185 176 200 195 170 173
Thermal
decomposition
temperature
(Td)
TGA A °C 400 400 410 410 360 360 360 380 350
CTE
x-axis
α1 IPC-
TM-650
2.4.24
A ppm/°C 14-16 14-16 14-16 14-16 12-14 12-14 12-15 14-16 11-13
CTE
y-axis
14-16 14-16 14-16 14-16 13-15 13-15 12-15 14-16 13-15
CTE
z-axis
α1 IPC-
TM-650
2.4.24
A 42 42 45 45 35 32 31 34 44
α2 280 280 260 260 265 250 240 200 255
T288
(with copper)
IPC-
TM-650
2.4.24.1
A min >120 >120 >120 >120 30 50 35 25 20
Dielectric
constant
(Dk)
1GHz IPC-
TM-650
2.5.5.9
C-24/23/50 3.4 3.6 3.4 3.7 3.8 3.8 3.9 4.1 4.4
Dissipation
factor
(Df)
0.001 0.002 0.002 0.002 0.005 0.005 0.005 0.010 0.016
Water
absorption
IPC-
TM-650
2.6.2.1
A % 0.06 0.06 0.14 0.14 0.14 0.14 0.14 0.14 0.12
Flexural
modulus
Fill JIS C 6481 A GPa 18 19 18 19 23 23 24 23 22
Peel
strength*
1oz
(35μm)
IPC-
TM-650
2.4.8
A kN/m 0.8 0.8 0.8 0.8 1.1 1.3 1.2 1.3 1.5

The sample thickness of MEGTRON7, MEGTRON6 is 0.75mm. The sample thickness of other part number is 0.8mm.
*MEGTRON7, MEGTRON6 is H-VLP copper. MEGTRON4, MEGTRON4S, MEGTRON M is RT copper. MEGTRON2, HIPER V is ST copper.

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)

The above data are typical values and not guaranteed values.