Thermosetting stretchable film BEYOLEX

Non-silicone thermosetting insulation film with high heat resistance and environmental stability.
A pliable and stretchable substrate follows 3D shapes that cannot be achieved with conventional flexible substrates.
Can be the foundation for many new innovative applications for stretchable electronics.

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  • Application
  • Detailed use
Devices in printed electronics applications such as wearable, healthcare, medical, automotive, energy harvesting, aerospace, etc.


Good elongation
Low hysteresis
High temperature resistance


BEYOLEX is an unique insulation material based on a proprietary, thermoset, non-silicone polymer system which provides softness, conformability, high-temperature resistance, and compatibility with a wide variety of functional inks and pastes, contributes to the creation of new innovative stretchable electronics.



General properties

Item Test method *¹ Unit BEYOLEX
Elongation ASTM D822 Initial % 200 <
Aft. High Temp. and High Humid. test *² 200 <
Aft. Heat cycle *³ 200 <
Modulus @50% strain ASTM D822 Initial MPa < 2.5
Aft. High Temp. and High Humid. test < 2.5
Aft. Heat cycle < 2.5
Hysteresis Panasonic Original Initial % < 0.1
Aft. High Temp. and High Humid. test < 0.1
Aft. Heat cycle < 0.1
Heat resistance TG/DTA (@Air) 5% weight loss °C 302
Breakdown voltage IEC 60243-1 KV/mm 98
Dielectric constant(Dk) IPC TM650 @10GHz / @2GHz 2.8 / 3.3
Dissipation factor(Df) @10GHz / @2GHz 0.052 / 0.073
Transparency ISO 13468-1 % > 90
Stretch cycle 50% stretch cycle > 10000

*1 Measurement are compliant with the standards other than Panasonic’s original test.
*2 Test Condition: 85°C/ 85%RH/ 1000h
*3 Test Condition: -55°C(5min) ↔ 125°C(5min)/ 1000cyc

The above data are typical values and not guaranteed values.

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