- Inhibiting solder joint failure and improving assembly-level reliability for automotive quality by temperature resistance and low CTE.
- With a pot life of 72 hours under ambient conditions, offering improved handling performance which means higher productivity during surface mount assembly.
- Improving the reliability of large surface mount package, as well as BGAs larger than 25 mm × 25 mm. Also be used for Cornerbond and Edgebond.
Semiconductor Encapsulation Materials
- Part Number
- Detailed use
Surface mounting PKG: CSP, BGA, WLCSP, QFN, MLCC, Image sensor, etc.
For large size PKG
Glass transition temp. (Tg)
Pot life: 72h
Product Introduction Video
ASYMTEK introduced the surface mount assembly reinforcement with a Jet Dispenser using Panasonic sidefill materials.
>>> Click to watch Sidefill Jetting video
Passing the temperature cycle test in harsh environments like automotive applications
Sidefill (Corner glue)
|Glass transition temperature (Tg)||°C||160|
|Elastic modulus (25°C)||GPa||20|
|Storage condition||-||-20°C / 6 months|
The above data are typical values and not guaranteed values.