High heat resistance Secondary mounting Sidefill materials | CV5797 series

CV5797 series

 

  1. Inhibiting solder joint failure and improving assembly-level reliability for automotive quality by temperature resistance and low CTE.
  2. With a pot life of 72 hours under ambient conditions, offering improved handling performance which means higher productivity during surface mount assembly.
  3. Improving the reliability of large surface mount package, as well as BGAs larger than 25 mm × 25 mm. Also be used for Cornerbond and Edgebond.

Semiconductor Encapsulation Materials/Adhesive

  • Part Number

CV5797 series

  • Application
  • Detailed use
Package
Automotive
・Package
・Automotive
Surface mounting PKG: CSP, BGA, WLCSP, QFN, MLCC, Image sensor, etc.

Properties

For large size PKG
Glass transition temp. (Tg)
160°C
Pot life: 72h

Surface Mount Assembly Reinforcement Type for PKGs

  

Product Introduction Video


 

 Other video

nordson ASYMTEK introduced the surface mount assembly reinforcement with a Jet Dispenser using Panasonic sidefill materials.
>>> Click to watch Sidefill Jetting video

Passing the temperature cycle test in harsh environments like automotive applications

Passing the temperature cycle test in harsh environments like automotive applications

General properties

Item Unit CV5797U
Glass transition temperature (Tg) °C 160
CTE ppm/°C 14
Storage condition - -20°C / 6 months
Pot life hours 72

The above data are typical values and not guaranteed values.

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