High heat resistance Secondary mounting Underfill materials | CV5794, CV5797

High heat resistance Secondary mounting Underfill materials

 

  1. Achieving the necessary mount reliability for automotive quality by industry's highest heat resistance and low CTE.
  2. "Corner reinforce type" also be available.
  3. Compliant with RoHS.

Semiconductor Encapsulation Materials/Adhesive

  •  Part Number 

CV5794 series
CV5797 series

  • Application
  • Detailed use
Package
Automotive
・Package
・Automotive
Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU

Properties

Industry's highest Tg 180℃
Compatible with the PKG size of
20 mm square or more
Possible to store at the
refrigerated condition(5℃)

Concept

Concept

High flowability for large size PKG

High flowability for large size PKG

Correspond to temperature cycle test under Automotive environment

Correspond to temperature cycle test under Automotive environment

General properties

Item Unit CV5794 series
Underfill
CV5797 series
Sidefill (Corner glue)
Minimum flow gap μm 20
Viscosity (25℃) Pa・s <1 500
Glass transition temperature (Tg) 180 160
C.T.E.1 ppm/℃ 20 12
Elastic modulus (25℃) GPa 13 20
Storage condition 5 5

The above data is actual values and not guaranteed values.

Related information