Products for Automotive components

Each application of Automotive components

Millimeter-wave radar
Electronic Control Unit
In-vehicle autonomous driving server
Headlight
GPS navigation, Control panel
Meter panel
Semiconductor Encapsulation, Surface Mount Assembly Reinforcement
Motor
Switching power supply
On Board Charger, DC/DC Converter, Inverter, In-Wheel Motor
Wire Harness
Electrical components, Structural components

Millimeter-wave radar

Antenna board

Product category	Product name	Product number	Features / Proposals
Circuit Board Materials	Halogen-free Ultra-low transmission loss Multi-layer circuit board materials	Laminate : R-5515 Prepreg : R-5410	Dk 3.0 Df 0.002@10GHz Tg (DMA) 200℃ Reduce PCB process cost (vs. PTFE material)
Circuit Board Materials	Ultra-low transmission loss multi-layer circuit board materials	Laminate : R-5785(N) Prepreg : R-5680(N)	High speed & ultra-low transmission loss High reliability Lead-free soldering
Circuit Board Materials	Ultra-low transmission loss multi-layer circuit board materials	Laminate : R-5775, R-5775(N) Prepreg : R-5670, R-5670(N)	High speed & ultra-low transmission loss High reliability Lead-free soldering
Circuit Board Materials	LCP flexible circuit board materials	Double-sided copper clad : R-F705S	Low transmission loss High frequency characteristics Moisture resistance

Control board

Product category	Product name	Product number	Features / Proposals
Circuit Board Materials	Low transmission loss multi-layer materials	Laminate : R-5725S, R-5725 Prepreg : R-5620S, R-5620	High speed & low transmission loss High reliability Lead-free soldering
Circuit Board Materials	Low transmission loss multi-layer materials	Laminate : R-5735 Prepreg : R-5630	High speed & low transmission loss High reliability Lead-free soldering
Circuit Board Materials	Low transmission loss multi-layer materials	Laminate : R-1577 Prepreg : R-1570	High speed & low transmission loss High heat resistance Halogen free
Circuit Board Materials	High heat resistance (High-Tg) multi-layer circuit board materials	Laminate : R-1755V Prepreg : R-1650V	High heat resistance High reliability Low CTE
Circuit Board Materials	Halogen-free multi-layer circuit board materials	Laminate : R-1566(W/WN) Prepreg : R-1551(W/WN)	Halogen free High reliability Tracking resistance (CTI: 400V or more but less than 600V)

Electronic Control Unit

Main board (in the engine room)

Product category	Product name	Product number	Features / Proposals
Circuit Board Materials	High heat resistance (High-Tg) multi-layer circuit board materials	Laminate : R-1755D Prepreg : R-1650D	High heat resistance High reliability High reliability of solder connection
Circuit Board Materials	High heat resistance (Middle-Tg) multi-layer circuit board materials	Laminate : R-1755M Prepreg : R-1650M	High heat resistance High reliability Low CTE
Circuit Board Materials	High heat resistance multi-layer circuit board materials	Laminate : R-1755E Prepreg : R-1650E	High heat resistance High reliability Low CTE
Circuit Board Materials	Halogen-free multi-layer circuit board materials	Laminate : R-1566(W/WN) Prepreg : R-1551(W/WN)	Halogen free High reliability Tracking resistance (CTI: 400V or more but less than 600V)

Main board (in the vehicles cabins)

Product category	Product name	Product number	Features / Proposals
Circuit Board Materials	High heat resistance multi-layer circuit board materials	Laminate : R-1755E Prepreg : R-1650E	High heat resistance High reliability Low CTE
Circuit Board Materials	Halogen-free multi-layer circuit board materials	Laminate : R-1566(W/WN) Prepreg : R-1551(W/WN)	Halogen free High reliability Tracking resistance (CTI: 400V or more but less than 600V)
Circuit Board Materials	Multi-layer circuit board materials	Laminate : R-1766 Prepreg : R-1661	Multilayer molding processability Excellent laminate processability Dimensional stability

In-vehicle autonomous driving server

Main board

Product category	Product name		Product number	Features / Proposals
Circuit Board Materials	Low Dk Highly heat resistant Halogen-free Multi-layer circuit board materials		Laminate : R-A555(W) Prepreg : R-A550(W)	Dk 3.4 ＠2GHz (Resin content 70wt%) CTE z-axis 41ppm/°C Tg(DMA) 200°C

Headlight

Main board

Product category	Product name		Product number	Features / Proposals
Circuit Board Materials	High thermal conductive glass composite circuit board materials		1.1W/m・K : R-1787	High heat dissipation Tracking resistance High reliability

GPS navigation, Control panel

Main board

Product category	Product name		Product number	Features / Proposals
Circuit Board Materials	Halogen-free multi-layer circuit board materials		Laminate : R-1566(W/WN) Prepreg : R-1551(W/WN)	Halogen free High reliability Tracking resistance (CTI: 400V or more but less than 600V)

Touch panel

Product category	Product name		Product number	Features / Proposals
Advanced Films	Moldable Low-Reflection Films		GSP109A	120-130% Stretchable Chemical resistance, Anti-Fingerprint Low-Reflection
Advanced Films	Anti-Rainbow and Anti-Blackout Films		MUAH4029 MUAH40J	Prevent Rainbows and Blackout Effective when using polarized sunglasses Fortified Surface with Anti-Fingerprint (MUAH40J)

HUD unit

Product category	Product name		Product number	Features / Proposals
Advanced Films	Functional Films for HUD cover		Thermal barrier film MUAH6 IRC102 Reducing double images film GSP Series	NIR Cut 75% or more* Visible light transmittance 80% or more (450nm)* Easy to Apply* *MUAH6

Meter panel

Main board

Product category	Product name		Product number	Features / Proposals
Circuit Board Materials	Glass composite circuit board materials		Double-sided copper clad : R-1786 Single-sided copper clad : R-1781	Tracking resistance High reliability Size-free

Light diffusion / reflection board

Product category	Product name		Product number	Features / Proposals
Plastic Molding Compound	For LED (optical parts) light diffusion / reflection PP molding compounds		MBG105H MBG130H	Light diffusion / reflection UV resistance Chemical resistance

Semiconductor Encapsulation, Surface Mount Assembly Reinforcement

Semiconductor Encapsulation

Product category	Product name		Product number	Features / Proposals
Semiconductor Encapsulation Materials	For Power modules high thermal conductive semiconductor encapsulation materials		CV4180 CV4380	High heat dissipation Stress reduction High adhesion
Semiconductor Encapsulation Materials	For high heat resistance power devices semiconductor encapsulation materials		CV8540 series	High heat resistance Low warpage, Low stress High insulation

Sidefill

Product category	Product name		Product number	Features / Proposals
Semiconductor Encapsulation Materials	High heat resistance Secondary mounting Sidefill materials		CV5797 series	For large size PKG Pot life: 72h

Underfill

Product category	Product name		Product number	Features / Proposals
Semiconductor Encapsulation Materials	High heat resistance Secondary mounting Underfill materials		CV5794 series	Compatible with the PKG size up to 20 mm square Pot life: 72h
Semiconductor Encapsulation Materials	Low-temperature curing Secondary mounting Underfill materials		CV5350 Series	High fluidity

Motor

Commutator

Product category	Product name		Product number	Features / Proposals
Plastic Molding Compound	High heat resistance phenolic molding compounds		CN6641 CN6771 CY4200 CY6786	High heat resistance High strength Dimensional stability

Switching power supply

Main board

Product category	Product name		Product number	Features / Proposals
Circuit Board Materials	Glass composite circuit board materials		Double-sided copper clad : R-1786 Single-sided copper clad : R-1781	Tracking resistance High reliability Size-free

On Board Charger, DC/DC Converter, Inverter, In-Wheel Motor

Main board

Product category	Product name	Product number	Features / Proposals
Circuit Board Materials	Halogen-free multi-layer circuit board materials	Laminate : R-1566(W/WN) Prepreg : R-1551(W/WN)	Halogen free High reliability Tracking resistance (CTI: 400V or more but less than 600V)
Circuit Board Materials	Highly heat resistant Halogen-free Multi-layer circuit board materials	Laminate : R-1566S Prepreg : R-1551S	Tg（DSC）175°C Td（TGA）355°C CTI≧600V (actual value)
Circuit Board Materials	High CTI, High RTI Halogen-free multi-layer circuit board materials	Laminate : R-3566D Prepreg : R-3551D	CTI≥600V¹ PLC=0 ¹ Measurement by ASTM method UL FR-15.1,RTI 150°C² ² 0.63mm or more High voltage CAF resistance(1000V)

Wire Harness

Product category	Product name		Product number	Features / Proposals
Circuit Board Materials	Flexible circuit board materials		Standard type : R-F775	Spring back performance Dimensional stability High heat resistance

Electrical components, Structural components

Housing, Bushing

Product category	Product name		Product number	Features / Proposals
Plastic Molding Compound	High heat resistance phenolic molding compounds		CN6641 CN6771 CY4200 CY6786	High heat resistance High strength Dimensional stability

Switch, Sensor

Product category	Product name		Product number	Features / Proposals
Plastic Molding Compound	Long-term reliable PBT molding compounds		MBS230	Long-term reliability High heat resistance Tracking resistance