- ICT infrastructure equipment,Antenna
- IC package
- LED lightings
- Mobile products
- Automotive components
- Industrial equipment Appliance Amusement, etc
Each application of Mobile products
Smart phone, Tablet PC
Main board
Product category | Product name | Product number | Features / Proposals | |
---|---|---|---|---|
![]() Circuit Board Materials |
Halogen-free multi-layer circuit board materials | ![]() |
Laminate : R-1566(W/WN) Prepreg : R-1551(W/WN) |
|
![]() Circuit Board Materials |
Low Dk halogen-free multi-layer circuit board materials | ![]() |
Laminate : R-A555(W) Prepreg : R-A550(W) |
|
![]() Circuit Board Materials |
Mass laminations(Shield board) | ![]() |
- |
|
IC package
Product category | Product name | Product number | Features / Proposals | |
---|---|---|---|---|
![]() Circuit Board Materials |
Ultra-thin circuit board materials | ![]() |
Laminate : R-1515E Prepreg : R-1410E |
|
Various modules, Connector
Product category | Product name | Product number | Features / Proposals | |
---|---|---|---|---|
![]() Circuit Board Materials |
LCP flexible circuit board materials | ![]() |
Double-sided copper clad : R-F705S |
|
![]() Circuit Board Materials |
Flexible circuit board materials resin coated copper foil | ![]() |
Material for thinner and multilayed : R-FR10 |
|
Touch panel
Product category | Product name | Product number | Features / Proposals | |
---|---|---|---|---|
![]() Advanced Films |
Anti-Glare Type Anti-Reflection Films | MUAG8 (G202N) |
|
|
![]() Advanced Films |
Clear Type Anti-Reflection Films | MUAR5 (C100N) |
|
|
![]() Advanced Films |
Moldable Low-Reflection Films | GSP109A |
|
|
![]() Advanced Films |
Anti-Rainbow and Anti-Blackout Films | MUAH4029 MUAH40J |
|
Semiconductor Encapsulation, Surface Mount Assembly Reinforcement, Adhesion
PoP, MUF
Product category | Product name | Product number | Features / Proposals | |
---|---|---|---|---|
![]() Semiconductor Encapsulation Materials, Adhesive |
Thin surface mounting semiconductor encapsulation materials | ![]() |
CV8710 CV8760 |
|
QFP/SOP, BGA/CSP
Product category | Product name | Product number | Features / Proposals | |
---|---|---|---|---|
![]() Semiconductor Encapsulation Materials, Adhesive |
Capillary Underfill(CUF) Semiconductor encapsulation materials | ![]() |
CV5300 CV5350 |
|
NCP, CUF
Product category | Product name | Product number | Features / Proposals | |
---|---|---|---|---|
![]() Semiconductor Encapsulation Materials, Adhesive |
Capillary Underfill(CUF) Semiconductor encapsulation materials | ![]() |
CV5300 CV5350 |
|
Sidefill/Underfill
Product category | Product name | Product number | Features / Proposals | |
---|---|---|---|---|
![]() Semiconductor Encapsulation Materials, Adhesive |
For Secondary mounting reinforcement drop impact resistance liquid encapsulant | ![]() |
CV5313 CV5314 |
|
Large encapsulation area
Product category | Product name | Product number | Features / Proposals | |
---|---|---|---|---|
![]() Semiconductor Encapsulation Materials, Adhesive |
For SMD module low warpage liquid encapsulant | ![]() |
CV5386 CV5401 |
|