Products for Mobile products

Smart phone, Tablet PC

Main board
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
Halogen-free multi-layer circuit board materials Halogen-free Laminate :
R-1566(W/WN)
Prepreg :
R-1551(W/WN)
  • Halogen and antimony free
  • High reliability
  • Tracking resistance
    (CTI: 400V or more but less than 600V)
Circuit Board Materials
Circuit Board Materials
Low Dk halogen-free multi-layer circuit board materials Halogen-free Laminate : R-A555(W)
Prepreg : R-A550(W)
  • Low Dk
  • Low CTE
  • High heat resistance
Circuit Board Materials
Circuit Board Materials
Mass laminations(Shield board) PreMulti -
  • High multi-layered ~24 layers
  • AOI inspection for all materials
  • Quick delivery
IC package
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
Low stress materials for thinner IC substrate MEGTRON GX Laminate :
R-G525T, R-G525F
Prepreg :
R-G520T, R-G520F
  • Low stress
  • Excellent warpage performance
  • Considerable cost advantage (E-glass)
Circuit Board Materials
Circuit Board Materials
Ultra-thin circuit board materials MEGTRON GX Laminate : R-1515E
Prepreg : R-1410E
  • Low warpage
  • Corresponding to ultra-thin
  • Halogen-free
Various modules, Connector
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
LCP flexible circuit board materials FELIOS LCP Double-sided copper clad : R-F705S
  • Low transmission loss
  • High frequency characteristics
  • Moisture resistance
Circuit Board Materials
Circuit Board Materials
Flexible circuit board materials resin coated copper foil FELIOS FRCC Material for thinner and multilayed : R-FR10
  • Can be multi-layered thin
  • Decrease a manufacture process
  • Halogen-free
Plastic Molding Compound
Plastic Molding Compound
High fluidity LCP resin molding compounds MBL540V
MBL240V
  • High weld strength
  • Thin-wall molding
  • Dimensional stability
Touch panel
Product category Product name Product number Features / Proposals
Advanced Films
Advanced Films
Top surface use anti-fingerprints AR film Fine Tiara MUAR6
  • Anti-fingerprints
  • High hardness / Scratch resistance
  • Low reflection
Advanced Films
Advanced Films
Top surface use blue light guard AR film Fine Tiara MUAB9
  • High transmittance
  • Natural color
  • Excellent visibility
Advanced Films
Advanced Films
Top surface use Anti-Reflection film Fine Tiara MUAR7
  • Anti-Reflection
  • Anti-Fouling
Advanced Films
Advanced Films
Internal use low reflection AR film Fine Tiara MUAC6
MUAR7
  • Improved visibility
  • High transmittance
  • Low reflection
Advanced Films
Advanced Films
Electrode use and internal use hard coat film Fine Tiara electrode use :
MUAH5 / 7
interal use : MUAH6
  • Invisible electrode pattern
  • With heat resistance PET protect film
  • Anti-scattering

Encapsulation / Mounting reinforcement / Adhesion

PoP, MUF
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
Thin surface mounting semiconductor encapsulation materials CV8710
CV8760
  • Thinner
  • High-density wiring
  • Warpage control
QFP/SOP, BGA/CSP
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
Capillary Underfill(CUF) Semiconductor encapsulation materials CV5300
CV5350
  • High fluidity
  • for Narrow gap/pitch
  • Reduced void/bleed
NCP, CUF
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
Capillary Underfill(CUF) Semiconductor encapsulation materials CV5300
CV5350
  • High fluidity
  • for Narrow gap/pitch
  • Reduced void/bleed
Underfill reinforcement
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
For Secondary mounting reinforcement drop impact resistance liquid encapsulant CV5313
CV5314
  • Drop impact resistance
  • Underfill reinforcement
  • Sidefill reinforcement
Large encapsulation area
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
For SMD module low warpage liquid encapsulant CV5386
CV5401
  • Warpage control
  • High adhesion
  • Reduced solder flash
Substrate in which parts incorporated
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
Multi functional sheet materials CV2000 series
  • Large-area encapsulation
  • High heat dissipation
Adhesion
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
Thermosetting/UV curing Adhesives CV5000 series
CV7000 series
  • Bonding of various materials
  • Solvent resistance
  • Time-lagged curing