Products for Mobile products

• ICT infrastructure equipment,Antenna
• IC package
• LED lightings
• Mobile products
• Automotive components
• Industrial equipment Appliance Amusement, etc

Each application of Mobile products

• Smart phone, Tablet PC
• Semiconductor Encapsulation, Surface Mount Assembly Reinforcement, Adhesion

Smart phone, Tablet PC

Main board

Product category	Product name		Product number	Features / Proposals
Circuit Board Materials	Halogen-free multi-layer circuit board materials		Laminate : R-1566(W/WN) Prepreg : R-1551(W/WN)	Halogen and antimony free High reliability Tracking resistance (CTI: 400V or more but less than 600V)
Circuit Board Materials	Low Dk halogen-free multi-layer circuit board materials		Laminate : R-A555(W) Prepreg : R-A550(W)	Low Dk Low CTE High heat resistance
Circuit Board Materials	Mass laminations(Shield board)		-	High multi-layered ～24 layers AOI inspection for all materials Quick delivery

IC package

Product category	Product name		Product number	Features / Proposals
Circuit Board Materials	Ultra-thin circuit board materials		Laminate : R-1515E Prepreg : R-1410E	Low warpage Corresponding to ultra-thin Halogen-free

Various modules, Connector

Product category	Product name		Product number	Features / Proposals
Circuit Board Materials	LCP flexible circuit board materials		Double-sided copper clad : R-F705S	Low transmission loss High frequency characteristics Moisture resistance
Circuit Board Materials	Flexible circuit board materials resin coated copper foil		Material for thinner and multilayed : R-FR10	Can be multi-layered thin Decrease a manufacture process Halogen-free

Touch panel

Product category	Product name		Product number	Features / Proposals
Advanced Films	Anti-Glare Type Anti-Reflection Films		MUAG8 (G202N)	Low Reflectance 0.5% (SCI) Excellent Weatherability Conforming to the DIN 75220 High Infrared Ray Transmittance
Advanced Films	Clear Type Anti-Reflection Films		MUAR5 (C100N)	Cutting-Edge Low Reflectance Neutral color High Infrared Ray Transmittance
Advanced Films	Moldable Low-Reflection Films		GSP109A	120-130% Stretchable Chemical resistance, Anti-Fingerprint Low-Reflection
Advanced Films	Anti-Rainbow and Anti-Blackout Films		MUAH4029 MUAH40J	Prevent Rainbows and Blackout Effective when using polarized sunglasses Fortified Surface with Anti-Fingerprint (MUAH40J)

Semiconductor Encapsulation, Surface Mount Assembly Reinforcement, Adhesion

PoP, MUF

Product category	Product name		Product number	Features / Proposals
Semiconductor Encapsulation Materials, Adhesive	Thin surface mounting semiconductor encapsulation materials		CV8710 CV8760	Thinner High-density wiring Warpage control

QFP/SOP, BGA/CSP

Product category	Product name		Product number	Features / Proposals
Semiconductor Encapsulation Materials, Adhesive	Capillary Underfill(CUF) Semiconductor encapsulation materials		CV5300 CV5350	High fluidity for Narrow gap/pitch Reduced void/bleed

NCP, CUF

Product category	Product name		Product number	Features / Proposals
Semiconductor Encapsulation Materials, Adhesive	Capillary Underfill(CUF) Semiconductor encapsulation materials		CV5300 CV5350	High fluidity for Narrow gap/pitch Reduced void/bleed

Sidefill/Underfill

Product category	Product name		Product number	Features / Proposals
Semiconductor Encapsulation Materials, Adhesive	For Secondary mounting reinforcement drop impact resistance liquid encapsulant		CV5313 CV5314	Drop impact resistance Underfill reinforcement Sidefill reinforcement

Large encapsulation area

Product category	Product name		Product number	Features / Proposals
Semiconductor Encapsulation Materials, Adhesive	For SMD module low warpage liquid encapsulant		CV5386 CV5401	Warpage control High adhesion Reduced solder flash