Products for IC package

BGA

Encapsulation / Mounting
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
Capillary Underfill(CUF) Semiconductor encapsulation materials CV5300
CV5350
  • High fluidity
  • for Narrow gap/pitch
  • Reduced void/bleed

FC-BGA

Application processor
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
Narrow pitch corresponding circuit board materials MEGTRON GX Laminate : R-1515W
Prepreg : R-1410W
  • High heat resistance
  • Low CTE
  • Mechanical drilling-ability
Circuit Board Materials
Circuit Board Materials
Narrow pitch corresponding circuit board materials MEGTRON GX Laminate : R-1515A
Prepreg : R-1410A
  • High heat resistance
  • Mechanical drilling-ability
  • Halogen-free

CSP

Memory
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
Ultra-thin circuit board materials MEGTRON GX Laminate : R-1515E
Prepreg : R-1410E
  • Low warpage
  • Corresponding to ultra-thin
  • Halogen-free
Encapsulation / Mounting
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
Capillary Underfill(CUF) Semiconductor encapsulation materials CV5300
CV5350
  • High fluidity
  • for Narrow gap/pitch
  • Reduced void/bleed

FC-CSP

Application processor
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
Low stress materials for thinner IC substrate MEGTRON GX Laminate :
R-G525T, R-G525F
Prepreg :
R-G520T, R-G520F
  • Low stress
  • Excellent warpage performance
  • Considerable cost advantage (E-glass)

PoP, MUF

Encapsulation / Mounting
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
Thin surface mounting semiconductor encapsulation materials CV8710
CV8760
  • Thinner
  • High-density wiring
  • Warpage control

NCP, CUF

Encapsulation / Mounting
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
Capillary Underfill(CUF) Semiconductor encapsulation materials CV5300
CV5350
  • High fluidity
  • for Narrow gap/pitch
  • Reduced void/bleed

Underfill/Sidefill reinforcement

Encapsulation / Mounting
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
For Secondary mounting reinforcement drop impact resistance liquid encapsulant CV5313
CV5314
  • Drop impact resistance
  • Underfill reinforcement
  • Sidefill reinforcement

Large encapsulation area

Encapsulation / Mounting
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
For SMD module low warpage liquid encapsulant CV5386
CV5401
  • Warpage control
  • High adhesion
  • Reduced solder flash

Substrate in which parts incorporated

Encapsulation / Mounting
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
Multi functional sheet materials CV2000 series
  • Large-area encapsulation
  • High heat dissipation

Module encapsulation

Automotive power module
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
For Power modules high thermal conductive semiconductor encapsulation materials CV4180
CV4380
  • High heat dissipation
  • Stress reduction
  • High adhesion
SiC power module
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
For Intelligent Power Module (IPM) High heat resistance semiconductor encapsulation materials X8540
  • Low warpage, Low stress
  • High heat resistance
  • High volume resistivity
Inverter module
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
For Power modules high thermal conductive semiconductor encapsulation materials CV4180
CV4380
  • High heat dissipation
  • Stress reduction
  • High adhesion
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
For Intelligent Power Module (IPM) High heat resistance semiconductor encapsulation materials X8540
  • Low warpage, Low stress
  • High heat resistance
  • High volume resistivity