Products for IC package

BGA

Encapsulation / Mounting
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
Capillary Underfill(CUF) Semiconductor encapsulation materials LEXCM DF CV5300 series
  • High fluidity
  • for Narrow gap/pitch
  • Reduced void/bleed

FC-BGA

Application processor
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
Narrow pitch corresponding circuit board materials LEXCM GX Laminate : R-1515W
Prepreg : R-1410W
  • High heat resistance
  • Low CTE
  • Mechanical drilling-ability
Circuit Board Materials
Circuit Board Materials
Narrow pitch corresponding circuit board materials LEXCM GX Laminate : R-1515A
Prepreg : R-1410A
  • High heat resistance
  • Mechanical drilling-ability
  • Halogen-free

CSP

Memory
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials
Ultra-thin circuit board materials LEXCM GX Laminate : R-1515E
Prepreg : R-1410E
  • Low warpage
  • Corresponding to ultra-thin
  • Halogen-free
Encapsulation / Mounting
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
Capillary Underfill(CUF) Semiconductor encapsulation materials LEXCM DF CV5300 series
  • High fluidity
  • for Narrow gap/pitch
  • Reduced void/bleed

PoP, MUF

Encapsulation / Mounting
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
Thin surface mounting semiconductor encapsulation materials LEXCM CF CV8710
CV8760
  • Thinner
  • High-density wiring
  • Warpage control

NCP, CUF

Encapsulation / Mounting
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
Capillary Underfill(CUF) Semiconductor encapsulation materials LEXCM DF CV5300 series
  • High fluidity
  • for Narrow gap/pitch
  • Reduced void/bleed

Surface Mount Assembly Reinforcement

Sidefill
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
High heat resistance Secondary mounting Sidefill materials LEXCM DF CV5797 series
  • For large size PKG
  • Tg 160°C
  • Pot life: 72h
Underfill
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
High heat resistance Secondary mounting Underfill materials LEXCM DF CV5794 series
  • Tg 160°C
  • Compatible with the PKG size up to 20 mm square
  • Pot life: 72h
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
Low-temperature curing Secondary mounting Underfill materials LEXCM DF CV5350AS
  • Cures at a low temp of 80°C
  • Tg is 140°C or greater
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
For secondary mounting reinforcement drop impact resistance liquid encapsulant LEXCM DF CV5313
CV5314
  • Drop impact resistance
  • Underfill/Sidefill reinforcement

Large encapsulation area

Encapsulation / Mounting
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
For SMD module low warpage liquid encapsulant LEXCM DF CV5386
CV5401
  • Warpage control
  • High adhesion
  • Reduced solder flash

Module encapsulation

Automotive power module
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
For Power modules high thermal conductive semiconductor encapsulation materials LEXCM CF CV4180
CV4380
  • High heat dissipation
  • Stress reduction
  • High adhesion
SiC power module
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
For high heat resistance power devices semiconductor encapsulation materials LEXCM CF CV8540 series
  • High heat resistance
  • Low warpage, Low stress
  • High insulation
Inverter module
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
For Power modules high thermal conductive semiconductor encapsulation materials LEXCM CF CV4180
CV4380
  • High heat dissipation
  • Stress reduction
  • High adhesion
Semiconductor Encapsulation Materials
Semiconductor
Encapsulation Materials
For high heat resistance power devices semiconductor encapsulation materials LEXCM CF CV8540 series
  • High heat resistance
  • Low warpage, Low stress
  • High insulation