- ICT infrastructure equipment,Antenna
- IC package
- LED lightings
- Mobile products
- Automotive components
- Industrial equipment Appliance Amusement, etc
Each application of IC package
BGA
Encapsulation / Mounting
FC-BGA
Application processor
CSP
Memory
Encapsulation / Mounting
PoP, MUF
Encapsulation / Mounting
NCP, CUF
Encapsulation / Mounting
Surface Mount Assembly Reinforcement
Sidefill
Underfill
Large encapsulation area
Encapsulation / Mounting
Module encapsulation
Automotive power module
SiC power module
Inverter module