Products for Industrial equipment, Appliance, Amusement, PC-related equipment, others

Each application of Industrial equipment, Appliance, Amusement, PC-related equipment, others

Inverter, Converter

Power supply system board
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials		 Thick copper glass composite circuit board materials Double-sided copper clad : R-1786
  • High current
    (Thick copper foil type)
  • Tracking resistance
  • High reliability
Circuit Board Materials
Circuit Board Materials		 High heat resistance (Middle-Tg) multi-layer circuit board materials HIPER M Laminate : R-1755M
Prepreg : R-1650M
  • High heat resistance
  • High reliability
  • Low CTE
Circuit Board Materials
Circuit Board Materials		 High heat resistance multi-layer circuit board materials HIPER E Laminate : R-1755E
Prepreg : R-1650E
  • High heat resistance
  • High reliability
  • Low CTE
Circuit Board Materials
Circuit Board Materials		 Halogen-free multi-layer circuit board materials Halogen-free Laminate :
R-1566(W/WN)
Prepreg :
R-1551(W/WN)
  • Halogen and antimony free
  • High reliability
  • Tracking resistance
    (CTI: 400V or more but less than 600V)
Circuit Board Materials
Circuit Board Materials		 High CTI, High RTI Halogen-free multi-layer circuit board materials Halogen-free Laminate : R-3566D
Prepreg : R-3551D
  • CTI≥600V*¹
    PLC=0
    *1 Measurement by ASTM method
  • UL FR-15.1
    RTI 150°C*²
    *2 0.63mm or more
  • High voltage CAF resistance
    (1000V)
Semiconductor Encapsulation
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials, Adhesive
Semiconductor
Encapsulation Materials,
Adhesive		 For Power modules high thermal conductive semiconductor encapsulation materials LEXCM CF CV4180
CV4380
  • High heat dissipation
  • Stress reduction
  • High adhesion
Semiconductor Encapsulation Materials, Adhesive
Semiconductor
Encapsulation Materials,
Adhesive		 For high heat resistance power devices semiconductor encapsulation materials LEXCM CF CV8540 series
  • High heat resistance
  • Low warpage, Low stress
  • High insulation

Home appliance

Power supply system board
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials		 High heat resistance multi-layer circuit board materials HIPER E Laminate : R-1755E
Prepreg : R-1650E
  • High heat resistance
  • High reliability
  • Low CTE
Circuit Board Materials
Circuit Board Materials		 Glass composite circuit board materials Double-sided copper clad : R-1786
Single-sided copper clad : R-1781
  • Tracking resistance
  • High reliability
  • Size-free
Circuit Board Materials
Circuit Board Materials		 Paper phenolic circuit board materials Single-sided copper clad : R-8700
  • Dimensional stability
  • Tracking resistance
  • Punching workability

Digital appliance

Power supply system board
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials		 Multi-layer circuit board materials Laminate : R-1766
Prepreg : R-1661
  • Multilayer molding processability
  • Excellent laminate processability
  • Dimensional stability
Circuit Board Materials
Circuit Board Materials		 Paper phenolic circuit board materials Single-sided copper clad : R-8700
  • Dimensional stability
  • Tracking resistance
  • Punching workability

Amusement machine

Main board
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials		 Mass laminations(Shield board) PreMulti -
  • High multi-layered ～24 layers
  • AOI inspection for all materials
  • Quick delivery

PC-related equipment

Main board
Product category Product name Product number Features / Proposals
Circuit Board Materials
Circuit Board Materials		 Halogen-free multi-layer circuit board materials Halogen-free Laminate :
R-1566(W/WN)
Prepreg :
R-1551(W/WN)
  • Halogen and antimony free
  • High reliability
  • Tracking resistance
    (CTI: 400V or more but less than 600V)
Circuit Board Materials
Circuit Board Materials		 Multi-layer circuit board materials Laminate : R-1766
Prepreg : R-1661
  • Multilayer molding processability
  • Excellent laminate processability
  • Dimensional stability
Casing
Product category Product name Product number Features / Proposals
Plastic Molding Compound
Plastic Molding Compound		 Melamine resin compound MM-S
MM-A		 Because of its excellent heat and water resistance, this product is used in household goods (like tableware, miscellaneous goods) as well as electrical parts

Wiring device

Wiring device
Product category Product name Product number Features / Proposals
Plastic Molding Compound
Plastic Molding Compound		 Urea resin molding Compound CU Because of its excellent coloring and electrical properties, this product is used in many electrical and electronics parts (like wall outlets)

Lighting parts

Lighting parts
Product category Product name Product number Features / Proposals
Plastic Molding Compound
Plastic Molding Compound		 Long-term reliable PBT molding compounds MBS230
  • Long-term reliability
  • High heat resistance
  • Tracking resistance

Surface Mount Assembly Reinforcement

Sidefill/Underfill
Product category Product name Product number Features / Proposals
Semiconductor Encapsulation Materials, Adhesive
Semiconductor
Encapsulation Materials,
Adhesive		 For Secondary mounting reinforcement drop impact resistance liquid encapsulant LEXCM AF CV5313
CV5314
  • Drop impact resistance
  • Underfill reinforcement
  • Sidefill reinforcement