For high heat resistance power devices semiconductor encapsulation materials | CV8540 series

For high heat resistance power devices semiconductor encapsulation materials

 

  1. By adopting a new epoxy system, this material has excellent heat resistance and can be applied to the next generation power devices (SiC, GaN).
  2. Contribute to improving power module performance and reliability under high temperature environment.

Semiconductor Encapsulation Materials

  •  Part Number 

CV8540 series

  • Application
  • Detailed use
Package
Automotive
・Package
・Automotive
Power devices used in industry/Automotive inverters

Properties

High heat resistance
Low warpage, Low stress
High insulation

EMC (Epoxy Molding Compound) explainer video

Concept

Concept

High heat resistance

High heat resistance

Dielectric property (Tg dependence)

Dielectric property (Tg dependence)

General properties

          
Item Unit LXCEM CF
CV8540 series
Glass transition temp. Tg (TMA) °C 185-205
CTE 1 ppm/°C 11-13
CTE 2 48
Flexural strength (25°C) MPa 130-160
Flexural modulus (25°C) GPa 15-19
Flammability (UL-94) V-0
Mold shrinkage % 0.25-0.4
Gelation time sec 30-40

The above data are typical values and not guaranteed values.

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