- By adopting a new epoxy system, this material has excellent heat resistance and can be applied to the next generation power devices (SiC, GaN).
- Contribute to improving power module performance and reliability under high temperature environment.
Semiconductor Encapsulation Materials
- Part Number
CV8540 series
- Application
- Detailed use
・Package
・Automotive
・Automotive
Power devices used in industry/Automotive inverters
Properties
High heat resistance
Low warpage, Low stress
High insulation
EMC (Epoxy Molding Compound) explainer video
Concept
High heat resistance
Dielectric property (Tg dependence)
General properties
| Item | Unit | LXCEM CF CV8540 series |
| Glass transition temp. Tg (TMA) | °C | 185-205 |
| CTE 1 | ppm/°C | 11-13 |
| CTE 2 | 48 | |
| Flexural strength (25°C) | MPa | 130-160 |
| Flexural modulus (25°C) | GPa | 15-19 |
| Flammability (UL-94) | – | V-0 |
| Mold shrinkage | % | 0.25-0.4 |
| Gelation time | sec | 30-40 |
The above data are typical values and not guaranteed values.
