For Automotive IC package Delamination free* surface mounting semiconductor encapsulation materials | CV8213 series

CV8213 series


  1. Achieved delamination free* with high adhesion strength and low stress property.
  2. High heat resistance for automotive application(AEC-Q100/grade0)

Semiconductor Encapsulation Materials

  • Part Number

CV8213 series

  • Application
  • Detailed use
Surface mounting PKG: SOP, QFP, LQFP, DPAK, LFPAK, TOLL


Delamination free*
with high adhesion and low stress
Automotive quality
AEC-Q100/grade 0
Also used for Clip-Bond Package
of automotive application

EMC (Epoxy Molding Compound) explainer video


Delamination free* achieved by MRT(Moisture reflow test)

Delamination free* achieved at 1000 cycles of TCT(Thermal Cycle Test)

General properties

Item Unit CV8213 series
Tg °C 125
C.T.E. (α1/α2) ppm/°C 10/46
Flex. Modulus (260°C) GPa 0.4
Moisture Absorption % 0.13
pH 7.0

The above data are typical values and not guaranteed values.

*Delamination free
1. Based on Panasonic's internal evaluation samples. No separation observed between the lead frame and the semiconductor encapsulation material were detected using on measurements made using SAT (Scanning Acoustic Tomography) Equipment.
2. Panasonic does not guarantee that no delaminated parts will be detected under any evaluation conditions.
3. With respect to delamination, the company recommends that all users evaluate the stability of parts and make a decision with respect to adoption.

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