Low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON M | R-5735

Low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON M R-5735

 

  1. Suitable for high-speed large-volume data transmission by servers and routers at high-end and volume designs.

Circuit Board Materials

  • Part Number

Laminate R-5735
Prepreg R-5630

  • Application
  • Detailed use
Network
Wireless
・Network
・Wireless
ICT infrastructure equipment, Supercomputer, Measuring instrument, Antenna, Etc.

Properties

Dk 3.9 Df 0.007
@10GHz
Tg(DSC)
195°C
T288(with copper)
35min

Transmission loss performance Ranking in MEGTRON series

Transmission loss performance Ranking in MEGTRON series

Frequency dependence by Transmission loss

Frequency dependence by Transmission loss

Heat resistance of High Multi-layered

Heat resistance of High Multi-layered

Solder heat resistance(float)

Solder heat resistance(float)

IST(Interconnect Stress Test)

IST(Interconnect Stress Test)

General properties

Item Test method Condition Unit MEGTRON M
R-5735
Glass transition temp.(Tg) DSC A °C 195
CTE z-axis α1 IPC-TM-650 2.4.24 A ppm/°C 31
α2 240
T288(with copper) IPC-TM-650 2.4.24.1 A min 35
Dielectric constant(Dk) 10GHz IPC-TM-650 2.5.5.5 C-24/23/50 3.9
Dissipation factor(Df) 0.007
Peel strength* 1oz(35μm) IPC-TM-650 2.4.8 A kN/m 1.2

The sample thickness is 0.8mm.
*RT Copper

The above data are typical values and not guaranteed values.

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