High modulus Low CTE IC substrate materials | R-G535S, R-G535E

High modulus Low CTE IC substrate materials R-G535

 

  1. Excellent low warpage at large-sized package by low CTE property.
  2. Good for high performance computing application.

Circuit Board Materials

  • Part Number

Low CTE glass cloth

Laminate R-G535S

Normal glass cloth

Laminate R-G535E

Halogen-free
  • Application
  • Detailed use
Package
・Package
IC substrate(FC-BGA)

New branding announcement

  • Panasonic Electronic Materials Division launches a new business brand for the Semiconductor Device Materials business.
    The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials (which includes substrates, encapsulants and underfills) and electronic assembly materials.
    Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.

Properties

CTE x, y-axis
4-6ppm/°C
Low Package Warpage
(FC-BGA)
Good MTH Processability
(Mechanical Through Hole)

IC Package Warpage

IC Package Warpage

Mechanical drilling processability

Mechanical drilling processability

General properties

Item Test method Condition Unit LEXCM GX
R-G535S
Low CTE glass cloth
LEXCM GX
R-G535E
Normal glass cloth
Glass transition temp.(Tg) DMA* A °C 250-260 250-260
CTE x-axis α1 IPC-TM-650 2.4.41 A ppm/°C 4-6 7-8
CTE y-axis 4-6 7-8
Dielectric constant(Dk) 1GHz IPC-TM-650 2.5.5.9 C-24/23/50 4.4 4.6
Dissipation factor(Df) 0.015 0.015
Flexural modulus JIS C 6481 20°C GPa 32-34 28-30

The sample thickness is 0.8mm.
* 0.4mm Measurement in tensile mode

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)

The above data are typical values and not guaranteed values.

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