High modulus Low CTE IC substrate materials | R-G535S, R-G535E

High modulus Low CTE IC substrate materials R-G535


  1. Excellent low warpage at large-sized package by low CTE property.
  2. Good for high performance computing application.

Circuit Board Materials

  • Part Number

Low CTE glass cloth

Laminate R-G535S

Normal glass cloth

Laminate R-G535E

  • Application
  • Detailed use
IC substrate(FC-BGA)

New branding announcement

  • Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.
    The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials (which includes substrates, encapsulants and underfills) and electronic assembly materials.
    Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.


CTE x, y-axis
Low Package Warpage
Good MTH Processability
(Mechanical Through Hole)

IC Package Warpage

IC Package Warpage

Mechanical drilling processability

Mechanical drilling processability

General properties

Item Test method Condition Unit LEXCM GX
Low CTE glass cloth
Normal glass cloth
Glass transition temp.(Tg) DMA* A °C 250-260 250-260
CTE x-axis α1 IPC-TM-650 2.4.41 A ppm/°C 4-6 7-8
CTE y-axis 4-6 7-8
Dielectric constant(Dk) 1GHz IPC-TM-650 C-24/23/50 4.4 4.6
Dissipation factor(Df) 0.015 0.015
Flexural modulus JIS C 6481 20°C GPa 32-34 28-30

The sample thickness is 0.8mm.
* 0.4mm Measurement in tensile mode

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),

The above data are typical values and not guaranteed values.

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