- Low CTE reduces warping and addresses a critical challenge with the IC packaging process.
- Flexibility and buffering features through a stress relaxation technology improves the reliability of the assembly process.
- Offering excellent thickness tolerances.
Circuit Board Materials
- Part Number
Low CTE glass cloth
Laminate R-1515V
Normal glass cloth
Laminate R-1515K
- Application
- Detailed use
・Package
IC substrate FC-BGA (CPU, GPU, FPGA, ASIC, etc.)
New branding announcement
- Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.
The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials (which includes substrates, encapsulants and underfills) and electronic assembly materials.
Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.
Press Release
Properties
CTE x, y-axis 3-5ppm/°C
(Low CTE glass cloth)
(Low CTE glass cloth)
Stress Relaxation
Good Thickness Variation
IC Package Warpage
A wide range of Thickness Line-up
Designed to Improve Reliability
General properties
| Item | Test method | Condition | Unit | R-1515V Low CTE glass cloth |
R-1515K Normal glass cloth |
Conventional Normal glass cloth |
|
|---|---|---|---|---|---|---|---|
| Glass transition temp.(Tg) | DMA*2 | A | °C | 260 | 260 | 260 | |
| CTE x-axis | α1 | TMA*2 | A | ppm/°C | 3-5 | 7 | 8-10 |
| CTE y-axis | 3-5 | 7 | 8-10 | ||||
| Dielectric constant(Dk)*1 | 1GHz | IPC-TM-650 2.5.5.9 | C-24/23/50 | – | 4.4 | 4.6 | 4.8 |
| Dissipation factor(Df)*1 | 0.016 | 0.015 | 0.015 | ||||
| Elastic modulus*1 | IPC-TM-650 2.4.4*3 | 25°C | GPa | 30 | 27 | 33 | |
| 250°C | 14 | 12 | 21 | ||||
| Peel strength | 1/3oz(12µｍ) | IPC-TM-650 2.4.8 | A | kN/m | 0.6 | 0.6 | 0.9 |
The sample thickness is 100µm.
*1 700µm
*2 Measurement in tensile mode.
*3 The IPC standard determines the test sample size, methods and conditions, etc.
but there is no formula for calculating the elastic modulus.
Therefore, we quantified it according to JIS C 6481.
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.
