High heat resistance Secondary mounting Underfill materials | CV5794 series

High heat resistance Secondary mounting Underfill materials

 

  1. Achieving the necessary mount reliability for automotive quality by high heat resistance and low CTE.
  2. With a pot life of 72 hours under ambient conditions, offering improved handling performance.
  3. Compliant with RoHS.

Semiconductor Encapsulation Materials/Adhesive

  •  Part Number 

CV5794 series

  • Application
  • Detailed use
Package
Automotive
・Package
・Automotive
Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU

Properties

High Tg 160℃
Compatible with the PKG size
up to 20 mm square
Pot life: 72h

Surface Mount Assembly Reinforcement Type for PKGs

  

Concept

Concept

High flowability for large size PKG

High flowability for large size PKG

Passing the temperature cycle test in harsh environments like automotive applications

Passing the temperature cycle test in harsh environments like automotive applications

General properties

Item Unit CV5794 series
Underfill
Minimum flow gap μm 20
Viscosity (25℃) Pa・s <1
Glass transition temperature (Tg) 160
C.T.E.1 ppm/℃ 23
Elastic modulus (25℃) GPa 13
Storage condition -20

The above data are typical values and not guaranteed values.

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