
- Achieving the necessary mount reliability for automotive quality by high heat resistance and low CTE.
- With a pot life of 72 hours under ambient conditions, offering improved handling performance.
- Compliant with RoHS.
Semiconductor Encapsulation Materials
- Part Number

CV5794 series
- Application
- Detailed use


・Package
・Automotive
・Automotive
Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU
Press Release
Properties
High Tg 160℃
Compatible with the PKG size
up to 20 mm square
up to 20 mm square
Pot life: 72h
Concept

High flowability for large size PKG

Passing the temperature cycle test in harsh environments like automotive applications

General properties
Item | Unit | CV5794L Underfill |
Minimum flow gap | μm | 20 |
Viscosity (25°C) | Pa・s | <1 |
Glass transition temperature (Tg) | °C | 160 |
C.T.E.1 | ppm/°C | 21 |
Elastic modulus (25°C) | GPa | 15 |
Storage condition | °C | -20°C/ 6 months |
The above data are typical values and not guaranteed values.