- Achieving the necessary mount reliability for automotive quality by high heat resistance and low CTE.
- With a pot life of 72 hours under ambient conditions, offering improved handling performance.
- Compliant with RoHS.
Semiconductor Encapsulation Materials/Adhesive
- Part Number
CV5794 series
- Application
- Detailed use
・Package
・Automotive
・Automotive
Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU
Press Release
Properties
High Tg 160℃
Compatible with the PKG size
up to 20 mm square
up to 20 mm square
Pot life: 72h
Surface Mount Assembly Reinforcement Type for PKGs
Concept
High flowability for large size PKG
Passing the temperature cycle test in harsh environments like automotive applications
General properties
| Item | Unit | CV5794 series Underfill |
| Minimum flow gap | μm | 20 |
| Viscosity (25°C) | Pa･s | <1 |
| Glass transition temperature (Tg) | °C | 160 |
| C.T.E.1 | ppm/°C | 21 |
| Elastic modulus (25°C) | GPa | 15 |
| Storage condition | °C | -20°C/ 6 months |
The written property values are just an example of our product line-up. Please contact us for details.
