Encapsulation Materials for FOWLP/PLP | CV8511C, CV2308, CV5791

Encapsulation Materials for FOWLP/PLP

 

  1. Available in forms of granule, liquid, and sheet, according to the required encapsulation thickness and size, enabling compression molding and lamination molding.
  2. Respond to growing size and low warpage of thin packages and contribute to the increased productivity of advanced semiconductor packages.

Semiconductor Encapsulation Materials/Adhesive

  •  Part Number 

CV8511C(EMC)
CV2308(Sheet)
CV5791(Liquid)

  • Application
  • Detailed use
Package
Mobile
・Package
・Mobile
Over-molding and wafer back-coating of advanced semiconductor packages, such as WLPs (FOWLPs and FIWLPs) and PLPs, for sophisticated mobile and wearable devices.

Properties

Low stress
Low shrinkage
Low temp.curability

FOWLP Technology Trend

FOWLP Technology Trend

Each material and corresponding package

Each material and corresponding package

Encapsulation method

Encapsulation method

General properties

Item Unit CV8511C CV2308 CV5791
Mold Size -

Wafer Level/Panel Level

Wafer Level/Panel Level

Molding -

Compression

Compression/Laminate Compression
Process -

Chip First/Chip Last

Form -

Granule

Granule

Sheet

sheet

Liquid

Liquid

Mold shrinkage % 0.1 0.01 -0.05
Tg 210 190 160
C.T.E.1 ppm/℃ 9 7 12
C.T.E.2 ppm/℃ 52 21 45
F.Modulus (R.T.) GPa 9 15 14

The above data is actual values and not guaranteed values.

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