Thin surface mounting semiconductor encapsulation materials | CV8710, CV8760

Thin surface mounting semiconductor encapsulation materials

 

  1. Corresponding to the high-density wiring and thinner (Fillability for narrow gap and narrow pitch)
  2. Corresponding to the flip-chip mounting. Making the substrate thinner (Package warpage control)

Semiconductor Encapsulation Materials/Adhesive

  •  Part Number 
ECOM Super Fine

CV8710 CV8760

  • Application
  • Detailed use
Package
Mobile
・Package
・Mobile
High-density, advanced package for mobile devices(PoP,MCP,Mold underfill package, etc.)

Properties

Thinner
High-density wiring
Warpage control

Trends and required performance

Trends and required performance

Use of high moldability-evaluation technology has achieved excellent fillability.

Use of high moldability-evaluation technology has achieved excellent fillability.

Lineup of materials selectable according to warpage

Lineup of materials selectable according to warpage

Related information