- Corresponding to the high-density wiring and thinner (Fillability for narrow gap and narrow pitch)
- Corresponding to the flip-chip mounting. Making the substrate thinner (Package warpage control)
Semiconductor Encapsulation Materials
- Part Number
CV8710 CV8760
- Application
- Detailed use
・Package
・Mobile
・Mobile
High-density, advanced package for mobile devices(PoP,MCP,Mold underfill package, etc.)
Properties
Thinner
High-density wiring
Warpage control
EMC (Epoxy Molding Compound) explainer video
Trends and required performance
Use of high moldability-evaluation technology has achieved excellent fillability.
Lineup of materials selectable according to warpage
