Molded Underfill(MUF) Semiconductor encapsulation Molding compounds | CV8710

Molded Underfill(MUF) Semiconductor encapsulation Molding compounds

 

  1. MUF materials realize underfilling to the narrow gap under flip-chip without void and overmolding the die at the same mold shot
  2. Provide a better solution based on high loading technology of fine filler and resin design technology

Semiconductor Encapsulation Materials / Adhesive

  •  Part Number 

CV8710

  • Application
  • Detailed use
PKG
Mobile
・PKG
・Mobile
Advanced IC Packages(Flip-chip package such as FC-CSP, FC-SiP module, etc.)

Features

Saving process time
Excellent fillability
for Narrow gap/pitch
Low warpage

Process comparison

Process comparison

Excellent fillability for Narrow gap and pitch

Excellent fillability for Narrow gap and pitch

Application

Application

General properties

Item Unit CV8710TAC CV8710TLC CV8710U CV8715BU X8710U-F1
EMC type Green Green Green Green Green
Filler cut point µm 30 20 10
Flexural modulus (R.T.) GPa 24 20 25 12 25
Tg (TMA) °C 135 150 143 140 156
C.T.E.1 ppm/°C 10 13 10 21 10
Mold shrinkage % 0.2 0.3 0.21 0.55 0.19

The above data is actual values and not guaranteed values.

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