Encapsulation Materials for FOWLP/PLP | CV8511CUB

Encapsulation Materials for FOWLP/PLP

 

  1. Available in forms of granule according to the required encapsulation thickness and size, enabling compression molding.
  2. Respond to growing size and low warpage of thin packages and contribute to the increased productivity of advanced semiconductor packages.

Semiconductor Encapsulation Materials

  •  Part Number 

CV8511CUB (EMC)

  • Application
  • Detailed use
Package
Mobile
・Package
・Mobile
Over-molding and wafer back-coating of advanced semiconductor packages, such as WLPs (FOWLPs and FIWLPs) and PLPs, for sophisticated mobile and wearable devices.

Properties

Low stress
Low shrinkage
Low temp.curability

FOWLP Technology Trend

Contribute to low warpage and thinner product

FOWLP Technology Trend

Line-up and corresponding package

We have wide range of Encapsulation Line-up for WLP/PLP

Line-up and corresponding package

Encapsulation method

Encapsulation method

General properties

Item Unit LEXCM CF
CV8511CUB
LEXCM CF
X85U-PT1-AP
Mold Size

Wafer Level / Panel Level

Wafer Level/Panel Level

Molding

Compression

Process

Chip First / Chip Last

Form

Granule

Granule

Mold shrinkage % 0.15 0.07
Tg °C 210 174
C.T.E.1 ppm/°C 8 7
C.T.E.2 ppm/°C 56 25
Flexural modulus (25°C) GPa 8 31

The above data are typical values and not guaranteed values.

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