Thin surface mounting semiconductor encapsulation materials | CV8710, CV8760

Thin surface mounting semiconductor encapsulation materials

 

  1. Corresponding to the high-density wiring and thinner (Fillability for narrow gap and narrow pitch)
  2. Corresponding to the flip-chip mounting. Making the substrate thinner (Package warpage control)

Product features

Thin surface mounting semiconductor encapsulation materials

ECOM Super Fine
  • CV8710 CV8760

For IC package

High-density, advanced package for mobile devices(PoP,MCP,Mold underfill package, etc.)

Trends and required performance

Trends and required performance

Use of high moldability-evaluation technology has achieved excellent fillability.

Use of high moldability-evaluation technology has achieved excellent fillability.

Lineup of materials selectable according to warpage

Lineup of materials selectable according to warpage

The above data is actual values and not guaranteed values.

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