
- Corresponding to the high-density wiring and thinner (Fillability for narrow gap and narrow pitch)
- Corresponding to the flip-chip mounting. Making the substrate thinner (Package warpage control)
Product features
Thin surface mounting semiconductor encapsulation materials

- CV8710 CV8760
For IC package
High-density, advanced package for mobile devices(PoP,MCP,Mold underfill package, etc.)
Trends and required performance

Use of high moldability-evaluation technology has achieved excellent fillability.

Lineup of materials selectable according to warpage

The above data is actual values and not guaranteed values.