![Thin surface mounting semiconductor encapsulation materials](/content/data/EM/pictures/ww_olimg_ecomth.jpg)
- Corresponding to the high-density wiring and thinner (Fillability for narrow gap and narrow pitch)
- Corresponding to the flip-chip mounting. Making the substrate thinner (Package warpage control)
Semiconductor Encapsulation Materials
- Part Number
![LEXCM CF](/content/data/EM/pictures/logo_lexcm_cf.gif)
CV8710 CV8760
- Application
- Detailed use
![Package](/content/data/EM/pictures/pict_sem_pkg.gif)
![Mobile](/content/data/EM/pictures/pict_sem_mob.gif)
・Package
・Mobile
・Mobile
High-density, advanced package for mobile devices(PoP,MCP,Mold underfill package, etc.)
Properties
Thinner
High-density wiring
Warpage control
EMC (Epoxy Molding Compound) explainer video
Trends and required performance
![Trends and required performance](/content/data/EM/pictures/ww_img_ecomth_01.jpg)
Use of high moldability-evaluation technology has achieved excellent fillability.
![Use of high moldability-evaluation technology has achieved excellent fillability.](/content/data/EM/pictures/ww_img_ecomth_02.jpg)
Lineup of materials selectable according to warpage
![Lineup of materials selectable according to warpage](/content/data/EM/pictures/ww_img_ecomth_03.jpg)