Low-temperature curing Secondary mounting Underfill materials | CV5350AS

Low-temperature curing Secondary mounting Underfill materials

 

  1. Cures at low temperatures and can be applied for mount-reinforcement of precision parts that need to be protected from higt temperatures.
  2. Improves the mounting reliability of automotive parts, for which high bonding strength is required.

Semiconductor Encapsulation Materials/Adhesive

  •  Part Number 

CV5350AS

  • Application
  • Detailed use
Automotive
Package
・Automotive
・Package
Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU, etc.

Properties

Cures at a low temp of 80℃
After curing, Tg is 140℃ or greater
Smaller difference in heat shrinkage
with other part, by high Tg
Possible to capillary flow up to 40mm
in the gap of 20μm

Moire data at Room temperature

Moire data at Room temperature

Suitable for mounting in areas with small gaps

Suitable for mounting in areas with small gaps

Correspond to temperature cycle test under Automotive environment

Correspond to temperature cycle test under Automotive environment

General properties

Item Unit CV5350AS
Minimum flow gap µm 20
Viscosity (25°C) mPa·s 4000
Glass transition temperature (Tg) °C 150
C.T.E.1 ppm/°C 30
Elastic modulus (25°C) GPa 10
Potential for reworking - Not possible

The above data is actual values and not guaranteed values.

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