Capillary Underfill(CUF) Semiconductor encapsulation materials | CV5300, CV5350

Capillary Underfill(CUF) Semiconductor encapsulation materials

 

  1. Capillary underfill material with reduced void, that realizes underfilling to the narrow gap and pitch by high fluidity.

Semiconductor Encapsulation Materials/Adhesive

  •  Part Number 

CV5300 CV5350

  • Application
  • Detailed use
Package
Mobile
・Package
・Mobile
High-density Advanced IC Packages(BGA, CSP, etc.)

Properties

High fluidity
Excellent fillability
for Narrow gap/pitch
Reduced void/bleed

Line-up

Line-up

Excellent fillability for Narrow gap/pitch

Excellent fillability for Narrow gap/pitch

Reduced void/bleed

Reduced void/bleed

General properties

Item Unit CV5300 CV5350
Filler size Max μm 1 5
C.T.E. ppm/℃ 33 30
Tg (TMA) 110 150
Modulus GPa 7 10

The above data is actual values and not guaranteed values.

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