- Capillary underfill material with reduced void, that realizes underfilling to the narrow gap and pitch by high fluidity.
Semiconductor Encapsulation Materials/Adhesive
- Part Number
CV5300 CV5350
- Application
- Detailed use
・Package
・Mobile
・Mobile
High-density Advanced IC Packages(BGA, CSP, etc.)
Properties
High fluidity
Excellent fillability
for Narrow gap/pitch
for Narrow gap/pitch
Reduced void/bleed
Line-up
Excellent fillability for Narrow gap/pitch
Reduced void/bleed
General properties
| Item | Unit | CV5300 | CV5350 |
| Filler size Max | μm | 1 | 5 |
| C.T.E. | ppm/℃ | 33 | 30 |
| Tg (TMA) | ℃ | 110 | 150 |
| Modulus | GPa | 7 | 10 |
The above data is actual values and not guaranteed values.
