- FELIOS adhesiveless flex materials are available in a wide-range of film and copper foil thicknesses to support all applications.
- FELIOS offers superior thermal resistance, dimensional stability and quality.
- Suitable for aerospace applications with low outgassing. (Compliant with ASTM E-595)
Circuit Board Materials
- Part Number
Double-sided copper clad
R-F775
Single-sided copper clad
R-F770
- Application
- Detailed use
・Aerospace
・Industry
・Automotive
・Industry
・Automotive
Consumer mobile products (Smartphone, tablet PC), Medical, Industrial, Avionics/Space applications, In-vehicle cable(Wire harness alternative), etc.
Properties
Superior thermal resistance
MOT 160°C
MOT 160°C
Wide line-up of film thickness
and copper foil
and copper foil
Excellent dimensional stability
Dimensional stability
Dimensional change after etching
Panasonic Industry FCCL materials
R-F775 After etching
Comparative material
After etching
Evaluation material is R18-100-R18, thickness 4mil.
The above data are typical values and not guaranteed values
Line-up
General properties
| Item | Test method | Condition | Unit | FELIOS R-F775 | |
| Solder heat resistance | IPC-TM-650 | A | °C | 280 | |
| C-96/40/90 | 240 | ||||
| Tensile Modulus | ASTM D882 | A | GPa | 7.5 | |
| Peel strength | RA: 1/2oz(18μm) | IPC-TM-650 | A | N/mm | >1.4 |
| CTE | MD-axis | TMA | 100°C→250°C 5°C/min | ppm/°C | 20 |
| TD-axis | 18 | ||||
| Dimensional stability | IPC-TM-650 | After etching MD direction | % | 0.00±0.10 | |
| After etching TD direction | 0.00±0.10 | ||||
| Outgas | TML / CVCM / WVR* | ASTM E595-07 ASTM E595-15 | － | % | 0.62 / 0.001 / 0.51 |
The sample thickness is film 50μm, copper foil 18μm.
* TML: Total Mass Loss
CVCM: Collected Volatile Condensable Material
WVR: Water Vapor Recovered
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.
