Major application | Product name | Product number | Features / Proposals | Detailed application | |
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Automotive Antenna |
Multi-layer Circuit Board Materials for wireless/ RF communication equipment | series |
Multi-layer circuit board materials that achieve low transmission losses in Radio Frequency range. | ||
Automotive Antenna |
Halogen-free Ultra-low transmission loss Multi-layer Circuit board materials | Laminate : R-5515X Prepreg : R-5410X Laminate : R-5515 Prepreg : R-5410 |
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Automotive Antenna |
High thermal conductivity Low transmission loss Halogen-free Multi-layer circuit board materials | Laminate : R-5575X Prepreg : R-5470X Laminate : R-5575 Prepreg : R-5470 |
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ICT infrastructure equipment |
Low transmission loss multi-layer materials | series |
Multi-layer circuit board materials suitable to large capacity and high speed transmission of high frequency signal | ||
ICT infrastructure equipment |
Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials | Laminate : R-579YS(U) R-579YS(N) Prepreg : R-569YS(U) R-569YS(N) Laminate : R-5795S(U) R-5795S(N) Prepreg : R-5690S(U) R-5690S(N) |
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ICT infrastructure equipment |
Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials | Laminate : R-579Y(U) R-579Y(N) Prepreg : R-569Y(U) R-569Y(N) Laminate : R-5795(U) R-5795(N) Prepreg : R-5690(U) R-5690(N) |
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ICT infrastructure equipment Aerospace |
Ultra-low transmission loss multi-layer circuit board materials | Laminate : R-578Y(N) R-578Y(GN) R-578Y(GE) R-578Y(R)* Prepreg : R-568Y(N) R-568Y(GN) R-568Y(GE) Laminate : R-5785(N) R-5785(GN) R-5785(GE) R-5785(R)* Prepreg : R-5680(N) R-5680(GN) R-5680(GE) *Buried Resistor Copper Foil |
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ICT infrastructure equipment |
Halogen-free Ultra-low transmission loss Multi-layer circuit board materials | Laminate : R-537Y(N) R-537Y(E) Prepreg : R-527Y(N) R-527Y(E) Laminate : R-5375(N) R-5375(E) Prepreg : R-5370(N) R-5370(E) |
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ICT infrastructure equipment Aerospace |
Ultra-low transmission loss multi-layer circuit board materials | Laminate : R-5775(N) R-5775(K) R-5775(G) R-5775(S)* R-5775(R)* Prepreg : R-5670(N) R-5670(K) R-5670(G) *Buried Resistor Copper Foil |
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ICT infrastructure equipment |
Low transmission loss multi-layer materials | Laminate : R-5725S, R-5725 Prepreg : R-5620S, R-5620 |
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ICT infrastructure equipment |
Low transmission loss multi-layer materials | Laminate : R-5735 Prepreg : R-5630 |
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ICT infrastructure equipment |
Low transmission loss multi-layer materials | Laminate : R-1577 Prepreg : R-1570 |
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Automotive |
High heat resistance multi-layer materials | series |
Lineup of multi-layer circuit board materials with excellent high heat resistance and high reliability | ||
ICT infrastructure equipment |
High heat resistance (High-Tg) multi-layer circuit board materials | Laminate : R-1755V Prepreg : R-1650V |
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Automotive |
High heat resistance (High-Tg) multi-layer circuit board materials | Laminate : R-1755D Prepreg : R-1650D |
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Automotive |
High heat resistance (Middle-Tg) multi-layer circuit board materials | Laminate : R-1755M Prepreg : R-1650M |
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Automotive |
High heat resistance multi-layer circuit board materials | Laminate : R-1755E Prepreg : R-1650E |
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Automotive Mobile products |
Halogen-free multi-layer circuit board materials | series |
Lineup of environment-friendly materials corresponding to the various application of mobile products. | ||
Automotive Mobile products |
Halogen-free multi-layer circuit board materials | Laminate : R-1566, R-1566(W) R-1566(WN) Prepreg : R-1551, R-1551(W) R-1551(WN) |
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Automotive |
High heat resistance halogen-free multi-layer circuit board materials | Laminate : R-1566S Prepreg : R-1551S |
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Automotive Industry |
High CTI, High RTI Halogen-free multi-layer circuit board materials | Laminate : R-3566D Prepreg : R-3551D |
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Mobile products Automotive |
Low Dk halogen-free multi-layer circuit board materials | Laminate : R-A555(W) Prepreg : R-A550(W) |
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Automotive, etc. (many applications) |
Glass epoxy multi-layer circuit board materials | Laminate : R-1766 Prepreg : R-1661 |
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Automotive Power module |
High thermal conductive Bonding sheet | R-14TY R-14T1 |
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Mobile products |
Flexible circuit board materials | series |
We meet the diverse mounting needs of mobile products such as smartphones and digital appliances | ||
Mobile products |
Flexible circuit board materials | R-F775 |
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Mobile products Automotive |
LCP flexible circuit board materials | Double-sided copper clad : R-F705S |
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Mobile products |
Low transmission loss flexible multi-layer circuit board materials | Low Dk bonding sheet : R-BM17 Core : R-F705 |
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Mobile products |
Flexible circuit board materials resin coated copper foil | Material for thinner, multilayed : R-FR10 |
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Automotive Appliance LED lightings |
Glass composite circuit board materials | Circuit board materials which realize safety performance of the industry-leading and excellent cost performance by size-free manufacturing method. | |||
Automotive Appliance |
High reliability Glass composite circuit board materials | Double-sided copper clad : R-1785 |
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LED lightings |
High thermal conductive glass composite circuit board materials | Double-sided : R-1787 |
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Appliance Antenna |
Glass composite circuit board materials | Double-sided copper clad : R-1786 Single-sided copper clad : R-1781 |
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Appliance High current applications |
Thick copper glass composite circuit board materials | Double-sided copper clad : R-1786 |
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Appliance LED lightings |
Paper Phenolic Circuit Board Materials | Circuit board materials which is applied to the high-density packaging products by excellent electrical fire safety and dimensional stability. Excellent tracking resistance (CTI600). |
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Appliance LED lightings |
Paper phenolic circuit board materials | Single-sided copper clad : R-8700 |
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