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Panasonic provides electronic materials best suited to customer needs, including circuit board materials and sealing materials for large and narrow-pitch semiconductor packages, as well as liquid materials and adhesives for mounting reinforcement.

BGA

CSP

NCP, CUF

Large Encapsulation Area

FC-BGA

PoP, MUF

Surface Mount Assembly Reinforcement

Module Encapsulation

Recommended Products

Block	Recommended Products	Related Use Case
BGA	Capillary Underfill(CUF) Semiconductor encapsulation materials	Encapsulation/Mounting
FC-BGA	High elasticity Low CTE IC substrate materials	Application processor
	Low CTE IC substrate materials	Application processor
CSP	High elasticity Low CTE Ultra-thin IC substrate materials	Memory
	Capillary Underfill(CUF) Semiconductor encapsulation materials	Encapsulation/Mounting
PoP, MUF	Thin surface mounting semiconductor encapsulation materials	Encapsulation/Mounting
NCP, CUF	Capillary Underfill(CUF) Semiconductor encapsulation materials	Encapsulation/Mounting
Surface Mount Assembly Reinforcement	High heat resistance Secondary mounting Sidefill materials	Sidefill
	High heat resistance Secondary mounting Underfill materials	Underfill
	Low-temperature curing Secondary mounting Underfill materials	Underfill
	For secondary mounting reinforcement drop impact resistance liquid encapsulant	Sidefill/Underfill
Large Encapsulation Area	For SMD module low warpage liquid encapsulant	Encapsulation/Mounting
Module Encapsulation	For power modules high thermal conductive semiconductor encapsulation materials	Automotive power module / Inverter module
	For high heat resistance power devices semiconductor encapsulation materials	SiC power module / Inverter module