전자재료

Product List

• 전자회로기판재료
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    Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series
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    High frequency circuit board materials for wireless/RF applications "XPEDION"series
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    Multi-layer Circuit Board Materials for Automotive Components "HIPER" series
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    Circuit Board Materials for LED lightings "ECOOL" series
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    Flexible Circuit Board Materials for Mobile Products "FELIOS" series
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    Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series
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    Glass Epoxy Circuit Board Materials
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    Glass Composite Circuit Board Materials
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    Paper Phenolic Circuit Board Materials
• Semiconductor Device Materials
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    IC Substrate Materials "LEXCM GX" series
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    Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series
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    Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
  •  
    Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series
• 플라스틱 성형재료
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    Plastic Molding Compound for LED "FULL BRIGHT" series
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    Long-term reliable PBT Molding Compound
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    Urea molding compounds
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    Melamine molding compounds
• 기능 필름
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    Functional films for HUD cover
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    Moldable Low-Reflection Films
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    Anti-Rainbow and Anti-Blackout Films
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    Anti-Reflection Films
• Other New Materials
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    Multifunctional Shock Absorber
  •  
    Thermosetting stretchable film BEYOLEX

 

공지 사항

[ 2025 ]

• 4월
  21일
  Information
  MEGTRON7 Qualified for PCB at European Space Agency ESA

[ 2023 ]

• 10월
  18일
  Information
  Panasonic Industry Demonstrates Durability of Electronic Materials in Exposure Experiments in Harsh Space Environment
• 3월
  16일
  Information
  Panasonic's Cutting-edge Electronic Materials for Aerospace Applications to Be Launched for Space Exposure Experiments

[ 2022 ]

• 8월
  25일
  Information
  Panasonic Engages in Joint Research on Ultra-light EMC Shielding Material Development with JAXA
• 6월
  22일
  Information
  Panasonic to Conduct Space Exposure Experiments Aiming to Develop Cutting-edge Electronic Materials for Aerospace Applications

News list