Product List전자회로기판재료Expand Secondary Navigation Menu Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series High frequency circuit board materials for wireless/RF applications "XPEDION"series Multi-layer Circuit Board Materials for Automotive Components "HIPER" series Circuit Board Materials for LED lightings "ECOOL" series Flexible Circuit Board Materials for Mobile Products "FELIOS" series Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series Glass Epoxy Multi-layer Circuit Board Materials Mass laminations(Shield board) "PreMulti" Glass Composite Circuit Board Materials Paper Phenolic Circuit Board MaterialsSemiconductor Device MaterialsExpand Secondary Navigation Menu IC Substrate Materials "LEXCM GX" series Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series플라스틱 성형재료Expand Secondary Navigation Menu Plastic Molding Compound for LED "FULL BRIGHT" series High heat resistance Phenolic Molding Compound for Automotive Components Long-term reliable PBT Molding Compound for Automotive Components Urea molding compounds Melamine molding compounds기능 필름Expand Secondary Navigation Menu Advanced Functional Films for Automotive ApplicationsOther New MaterialsExpand Secondary Navigation Menu Multifunctional Shock Absorber Thermosetting stretchable film BEYOLEX Ultra-light EMC shielding material