전자재료

Product List

• 전자회로기판재료Expand Secondary Navigation Menu
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    Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series
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    High frequency circuit board materials for wireless/RF applications "XPEDION"series
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    Multi-layer Circuit Board Materials for Automotive Components "HIPER" series
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    Circuit Board Materials for LED lightings "ECOOL" series
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    Flexible Circuit Board Materials for Mobile Products "FELIOS" series
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    Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series
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    Glass Epoxy Multi-layer Circuit Board Materials
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    Mass laminations(Shield board) "PreMulti"
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    Glass Composite Circuit Board Materials
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    Paper Phenolic Circuit Board Materials
• Semiconductor Device MaterialsExpand Secondary Navigation Menu
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    IC Substrate Materials "LEXCM GX" series
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    Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM LF" series
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    Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
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    Liquid Materials for Board level Underfill, Adhesives
• 플라스틱 성형재료Expand Secondary Navigation Menu
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    Plastic Molding Compound for LED "FULL BRIGHT" series
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    High heat resistance Phenolic Molding Compound for Automotive Components
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    Long-term reliable PBT Molding Compound for Automotive Components
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    Urea molding compounds
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    Melamine molding compounds
• 기능 필름Expand Secondary Navigation Menu
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    Advanced Functional Films for Automotive Applications
• Other New MaterialsExpand Secondary Navigation Menu
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    Multifunctional Shock Absorber
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    Thermosetting stretchable film BEYOLEX
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    Ultra-light EMC shielding material