Product List전자회로기판재료 Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series High frequency circuit board materials for wireless/RF applications "XPEDION"series Multi-layer Circuit Board Materials for Automotive Components "HIPER" series Circuit Board Materials for LED lightings "ECOOL" series Flexible Circuit Board Materials for Mobile Products "FELIOS" series Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series Glass Epoxy Circuit Board Materials Mass laminations(Shield board) "PreMulti" Glass Composite Circuit Board Materials Paper Phenolic Circuit Board MaterialsSemiconductor Device Materials IC Substrate Materials "LEXCM GX" series Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series플라스틱 성형재료 Plastic Molding Compound for LED "FULL BRIGHT" series Long-term reliable PBT Molding Compound Urea molding compounds Melamine molding compounds기능 필름 Functional films for HUD cover Moldable Low-Reflection Films Anti-Rainbow and Anti-Blackout Films Anti-Reflection FilmsOther New Materials Multifunctional Shock Absorber Thermosetting stretchable film BEYOLEX Ultra-light EMC shielding material