Product List
- 전자회로기판재료Expand Secondary Navigation Menu
- IC Substrate Materials "LEXCM GX" series
- Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series
- Multi-layer Circuit Board Materials for wireless/RF communication equipment
- Multi-layer Circuit Board Materials for Automotive Components "HIPER" series
- Circuit Board Materials for LED lightings "ECOOL" series
- Flexible Circuit Board Materials for Mobile Products "FELIOS" series
- Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series
- Glass Epoxy Multi-layer Circuit Board Materials
- Mass laminations(Shield board) "PreMulti"
- Glass Composite Circuit Board Materials
- Paper Phenolic Circuit Board Materials
- 반도체 봉지재, 접착제Expand Secondary Navigation Menu
- 플라스틱 성형재료Expand Secondary Navigation Menu
- Plastic Molding Compound for LED "FULL BRIGHT" series
- High heat resistance Phenolic Molding Compound for Automotive Components
- High fluidity LCP resin Molding Compound for Mobile Products
- High heat dissipation Unsaturated Polyester resin Molding Compound for Automotive Components
- Long-term reliable PBT Molding Compound for Automotive Components
- Urea molding compounds
- Melamine molding compounds
- 기능 필름Expand Secondary Navigation Menu
- Other New MaterialsExpand Secondary Navigation Menu