Product List
- 전자회로기판재료Expand Secondary Navigation Menu
- Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series
- High frequency circuit board materials for wireless/RF applications "XPEDION"series
- Multi-layer Circuit Board Materials for Automotive Components "HIPER" series
- Circuit Board Materials for LED lightings "ECOOL" series
- Flexible Circuit Board Materials for Mobile Products "FELIOS" series
- Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series
- Glass Epoxy Multi-layer Circuit Board Materials
- Mass laminations(Shield board) "PreMulti"
- Glass Composite Circuit Board Materials
- Paper Phenolic Circuit Board Materials
- Semiconductor Device MaterialsExpand Secondary Navigation Menu
- IC Substrate Materials "LEXCM GX" series
- Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series
- Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
- Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series
- 플라스틱 성형재료Expand Secondary Navigation Menu
- 기능 필름Expand Secondary Navigation Menu
- Other New MaterialsExpand Secondary Navigation Menu