- Suitable for high-speed large-volume data transmission by servers and routers at high-end and volume designs.
Circuit Board Materials
- Part Number
Laminate R-5725S
Prepreg R-5620S
Laminate R-5725
Prepreg R-5620
- Application
- Detailed use
・Network
・Wireless
・Wireless
ICT infrastructure equipment, Supercomputer, Measuring instrument, Antenna, Etc.
Properties
Dk 3.8 Df 0.007
@10GHz
@10GHz
Tg(DSC)
R-5725S 200°C
R-5725 176°C
R-5725S 200°C
R-5725 176°C
T288(with copper)
R-5725S 50min
R-5725 30min
R-5725S 50min
R-5725 30min
Video
Transmission loss performance Ranking in MEGTRON series
Frequency dependence by Transmission loss
Heat resistance of High Multi-layered
Dielectric property
Solder heat resistance(float)
IST(Interconnect Stress Test)
General properties
| Item | Test method | Condition | Unit | MEGTRON4 R-5725 |
MEGTRON4S R-5725S |
|
|---|---|---|---|---|---|---|
| Glass transition temp.(Tg) | DSC | A | °C | 176 | 200 | |
| CTE z-axis | α1 | IPC-TM-650 2.4.24 | A | ppm/°C | 35 | 32 |
| α2 | 265 | 250 | ||||
| T288(with copper) | IPC-TM-650 2.4.24.1 | A | min | 30 | 50 | |
| Dielectric constant(Dk) | 10GHz | IPC-TM-650 2.5.5.5 | C-24/23/50 | － | 3.8 | 3.8 |
| Dissipation factor(Df) | 0.007 | 0.007 | ||||
| Peel strength* | 1oz(35μm) | IPC-TM-650 2.4.8 | A | kN/m | 1.1 | 1.3 |
The sample thickness is 0.8mm.
*RT Copper
The above data are typical values and not guaranteed values.
