- Suitable for high-speed large-volume data transmission of server and router at High-end/Volume zone.
Video
Transmission loss performance Ranking in MEGTRON series
Frequency dependence by Transmission loss
Heat resistance of High Multi-layer
Solder heat resistance(float)
IST(Interconnect Stress Test)
General properties
Item | Test method | Condition | Unit | MEGTRON M R-5735 |
|
---|---|---|---|---|---|
Glass transition temp.(Tg) | DSC | A | °C | 195 | |
CTE z-axis | α1 | IPC-TM-650 2.4.24 | A | ppm/°C | 31 |
α2 | 240 | ||||
T288(with copper) | IPC-TM-650 2.4.24.1 | A | min | 35 | |
Dielectric constant(Dk) | 10GHz | IPC-TM-650 2.5.5.5 | C-24/23/50 | - | 3.9 |
Dissipation factor(Df) | 0.007 | ||||
Peel strength* | 1oz(35μm) | IPC-TM-650 2.4.8 | A | kN/m | 1.2 |
The sample thickness is 0.8mm.
*RT Copper
The above data are typical values and not guaranteed values.