- Circuit Board Materials
- Semiconductor Encapsulation Materials, Adhesives
- Plastic Molding Compound
- Advanced Films
Major application | Product name | Product number | Features / Proposals | Detailed application |
---|---|---|---|---|
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Semiconductor Packaging Encapsulation Materials for Advanced Package | Contribute to improving the reliability of advanced semiconductor package such as wafer level package, FC CSP/BGA, Wifi module, etc. | ||
![]() ![]() IC package Mobile products |
Encapsulation Materials for FOWLP/PLP | CV8511C CV2308 CV5791 |
|
Over-molding and wafer back-coating of advanced semiconductor packages, such as WLPs (FOWLPs and FIWLPs) and PLPs, for sophisticated mobile and wearable devices |
![]() ![]() IC package Mobile products |
Molded Underfill(MUF) Semiconductor encapsulation Molding compounds | CV8710 |
|
Advanced IC Packages(Flip-chip package such as FC-CSP, FC-SiP module, etc.) |
![]() ![]() IC package Mobile products |
Capillary Underfill(CUF) Semiconductor encapsulation materials | CV5300 CV5350 |
|
High-density Advanced IC Packages(BGA, CSP, etc.) |
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Thin surface mounting semiconductor encapsulation materials | CV8710 CV8760 |
|
High-density, advanced package for mobile devices(PoP,MCP,Mold underfill package, etc.) |
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For SMD module low warpage liquid encapsulant | CV5386 CV5401 |
|
Communication module (MAP, COB) for mobile devices such as notebook PC, digital camera, mobile phone, smartphone, tablet PC. |
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Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment | Contribute to improving the reliability of semiconductor package such as a power device requiring automotive quality | ||
![]() ![]() IC package Automotive components |
For Automotive IC package Delamination free surface mounting semiconductor encapsulation materials | CV8213 |
|
Surface mounting PKG: SOP, QFP, LQFP, DPAK, LFPAK, TOLL |
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For power modules high thermal conductive semiconductor encapsulation materials | CV4180 CV4380 |
|
Inverter module for major appliances and industrial motors, Automotive module |
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For Intelligent Power Module (IPM) High heat resistance semiconductor encapsulation materials | X8540 |
|
Power Devices used in Industry/Automotive Inverters |
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Potting material | CV5000 series |
|
Potting, Casting, etc. |
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Liquid Materials for Board level Underfill, Adhesives | Secondary mounting reinforcement of semiconductor package such as CSP/BGA, Adhesive bonding of camera module/image sensor | ||
![]() ![]() IC package Automotive components |
Low-temperature curing Secondary mounting Underfill materials | CV5350AS |
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Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU, etc. |
![]() ![]() IC package Automotive components |
High heat resistance Secondary mounting Underfill materials | CV5794 CV5797 |
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Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU |
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For secondary mounting reinforcement drop impact resistance liquid encapsulant | CV5313 CV5314 |
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LSI package and SSD for mobile devices such as notebook PC, digital camera, mobile phones, smartphone and tablet PC. |
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Thermosetting/UV curing Adhesives | CV5000 CV7000 series |
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Image Sensor, etc. |