Semiconductor Encapsulation Materials, Adhesives - Electronic Materials - Industrial Devices & Solutions

Semiconductor Encapsulation Materials, Adhesives

Major application	Product name	Product number	Features / Proposals	Detailed application
IC package	Semiconductor Packaging Encapsulation Materials for Advanced Package		Contribute to improving the reliability of advanced semiconductor package such as wafer level package, FC CSP/BGA, Wifi module, etc.
IC package Mobile products	Encapsulation Materials for FOWLP/PLP	CV8511C CV2308 CV5791	Low stress Low shrinkage Low temp.curability	Over-molding and wafer back-coating of advanced semiconductor packages, such as WLPs (FOWLPs and FIWLPs) and PLPs, for sophisticated mobile and wearable devices
IC package Mobile products	Molded Underfill(MUF) Semiconductor encapsulation Molding compounds	CV8710	Saving process time for Narrow gap/pitch Low warpage	Advanced IC Packages(Flip-chip package such as FC-CSP, FC-SiP module, etc.)
IC package Mobile products	Capillary Underfill(CUF) Semiconductor encapsulation materials	CV5300 CV5350	High fluidity for Narrow gap/pitch Reduced void/bleed	High-density Advanced IC Packages(BGA, CSP, etc.)
IC package	Thin surface mounting semiconductor encapsulation materials	CV8710 CV8760	Thinner High-density wiring Warpage control	High-density, advanced package for mobile devices(PoP,MCP,Mold underfill package, etc.)
IC package	For SMD module low warpage liquid encapsulant	CV5386 CV5401	Warpage control High adhesion Reduced solder flash	Communication module (MAP, COB) for mobile devices such as notebook PC, digital camera, mobile phone, smartphone, tablet PC.
IC package	Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment		Contribute to improving the reliability of semiconductor package such as a power device requiring automotive quality
IC package Automotive components	For Automotive IC package Delamination free surface mounting semiconductor encapsulation materials	CV8213	High adhesion, low stress AEC-Q100/grade 0 for Clip-bond PKG	Surface mounting PKG: SOP, QFP, LQFP, DPAK, LFPAK, TOLL
IC package	For power modules high thermal conductive semiconductor encapsulation materials	CV4180 CV4380	High heat dissipation Stress reduction High adhesion	Inverter module for major appliances and industrial motors, Automotive module
IC package	For Intelligent Power Module (IPM) High heat resistance semiconductor encapsulation materials	X8540	Low warpage, Low stress High heat resistance High volume resistivity	Power Devices used in Industry/Automotive Inverters
IC package	Potting material	CV5000 series	Low stress High adhesion	Potting, Casting, etc.
IC package	Liquid Materials for Board level Underfill, Adhesives		Secondary mounting reinforcement of semiconductor package such as CSP/BGA, Adhesive bonding of camera module/image sensor
IC package Automotive components	Low-temperature curing Secondary mounting Underfill materials	CV5350AS	Cures at a low temp of 80°C Tg is 140°C or greater	Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU, etc.
IC package Automotive components	High heat resistance Secondary mounting Underfill materials	CV5794 CV5797	Tg 180°C for large size PKG Refrigerated storage	Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU
IC package	For secondary mounting reinforcement drop impact resistance liquid encapsulant	CV5313 CV5314	Drop impact resistance Underfill/Sidefill reinforcement	LSI package and SSD for mobile devices such as notebook PC, digital camera, mobile phones, smartphone and tablet PC.
IC package	Thermosetting/UV curing Adhesives	CV5000 CV7000 series	Bonding of various materials Solvent resistance Time-lagged curing	Image Sensor, etc.