Multi-layer Circuit Board Materials for Automotive Components "HIPER" series

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Multi-layer circuit board materials with excellent high heat resistance and reliability.

In harsh usage environments excellent CAF resistance, through-hole reliability, and laminate processability.

Circuit Board Materials

Item		Test method	Condition	Unit	HIPER V R-1755V	HIPER D R-1755D	HIPER M R-1755M	HIPER E R-1755E	Halogen -free R-1566	Conventional FR-4 R-1766
Glass transition temp (Tg)		DSC	A	°C	173	163	153	133	148	140
Thermal decomposition temp (Td)		TG/DTA	A	°C	350	345	355	370	350	315
CTE x-axis	α1	IPC TM-650 2.4.41	A	ppm/°C	11-13	10-12	11-13	11-13	11-13	11-13
CTE y-axis	α1	IPC TM-650 2.4.41	A		13-15	12-14	13-15	13-15	13-15	13-15
CTE z-axis	α1	IPC TM-650 2.4.24	A		44	43	40	42	40	65
CTE z-axis	α2	IPC TM-650 2.4.24	A		255	236	240	250	180	270
T288 (with copper)		IPC TM-650 2.4.24.1	A	min	20	15	18	25	3	1
Dielectric constant (Dk)	1GHz	IPC TM-650 2.5.5.9	C-24/23/50	–	4.4	4.4	4.6	4.6	4.6	4.3
Dissipation factor (Df)	1GHz	IPC TM-650 2.5.5.9	C-24/23/50	–	0.016	0.016	0.014	0.013	0.010	0.016
Water absorption		IPC TM-650 2.6.2.1	D-24/23	%	0.12	0.11	0.11	0.11	0.14	0.14
Flexural modulus	Fill	JIS C6481	A	GPa	22	21	22	22	22	21
Peel strength	1oz	IPC TM-650 2.4.8	A	kN/m	1.5	1.3	1.5	1.6	1.8	2.0

The sample thickness is 0.8mm.

The above data are typical values and not guaranteed values.