Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.
The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials
(which includes substrates, encapsulants and underfills) and electronic assembly materials.
Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.
The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials
(which includes substrates, encapsulants and underfills) and electronic assembly materials.
Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.
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What's New
2022
- June 22, 2022
- Panasonic to Conduct Space Exposure Experiments Aiming to Develop Cutting-edge Electronic Materials for Aerospace Applications
- Jan 18, 2022
- Panasonic Develops MEGTRON 8 Multi-Layer Circuit Board Materials Featuring Low Transmission Loss for High-Speed Communication Networking Equipment
2021
- Nov 10, 2021
- Price Revision on Semiconductor Encapsulation Materials
- Aug 6, 2021
- Introduction of New Material For Next Generation Display Development
TOUGHTELON - Jun 22, 2021
- Panasonic Commercializes a New Semiconductor Substrate Material Designed to Improve Reliability
- Mar 2, 2021
- Panasonic Commercializes Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement
- Feb 25, 2021
- Panasonic Commercializes R-5410 Halogen-free Ultra-low Transmission Loss Multi-Layer Circuit Board Material for Millimeter-Wave Antennas
2020
- Oct 12, 2020
- Panasonic Commercializes an Anti-Glare Type Anti-Reflection Film for Automotive Displays
- May 19, 2020
- Exhibition information: ECTC 2020 Virtual Conference
- Jan 7, 2020
- Revocation of our exhibition to “12th AUTOMOTIVE WORLD 2020”
2019
2018
- Dec 21, 2018
- Exhibition infomation : AUTOMOTIVE WORLD Tokyo 2019
- Dec 13, 2018
- To Bolster Substrate Material Business in North East Asian Region
- Sep 3, 2018
- Panasonic Commercializes Heat Resistant Underfill CV5794 Designed to Improve the Reliability of Automotive Electronics
- Aug 29, 2018
- Panasonic Commercializes Granular Epoxy Mold Compound (EMC) Semiconductor Encapsulation Materials for FOWLP and PLP
- Jun 4, 2018
- Panasonic Develops Glass Composite Circuit Board Material that Improves Parts Mounting Reliability
- May 29, 2018
- Panasonic Develops an Ultra-low Transmission Loss Circuit Board Material for Semiconductor Packages and Modules
- Mar 9, 2018
- Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations
- Feb 8, 2018
- Panasonic Launches Production of Molded Underfill Semiconductor Encapsulation Materials in Shanghai
- Jan 11, 2018
- Panasonic Develops "Halogen-free Ultra-low Transmission Loss Circuit Board Material" for Millimeter-wave Band Antennas
2017
- Jun 1, 2017
- Panasonic Commercializes "High Thermal Conductivity, Low Transmission Loss Halogen-free Multi-layer Circuit Board Material" for Wireless Base Stations
- May 12, 2017
- Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations
- Feb 3, 2017
- Panasonic Develops Low-temperature Curing Secondary Mounting Underfill Material that Improves Mounting Reliability of Automotive Parts
- Jan 17, 2017
- Panasonic Commercializes Low Transmission Loss Flexible Multi-layer Circuit Board Materials
2016
- Dec 27, 2016
- Price Revision for Copper clad Laminates and Mass Laminations
- Dec 22, 2016
- Panasonic Commercializes High Heat Resistance Halogen-free Multi-layer Circuit Board Material for Automotive Use
- Oct 18, 2016
- Panasonic Commercializes "Double-side Copper Laminate Polyethylene Terephthalate (PET) Films" for Large-screen Touch Panel Sensor
- Aug 25, 2016
- Panasonic Commercializes "Time-lagged UV Curing Adhesive" Suitable for Assembly of Mobile Phone Housings and UV-Protection Panels
- May 30, 2016
- Panasonic Commercializes a Substrate Material for Semiconductor Packages Featuring Reduced Internal Stress that Leads to Lower Warpage
- May 26, 2016
- Panasonic Commercializes "Sheet-Form Encapsulation Material for Coreless Package Substrates"
- Apr 5, 2016
- Panasonic Develops Light Diffusion Polypropylene Resin Molding Compounds "FULL BRIGHT" PP
- Mar 18, 2016
- Panasonic Commercializes a High Dielectric Constant Encapsulation Molding Compound Suitable for Finger-Print Sensor Packages
- Mar 3, 2016
- Panasonic Commercializes the Industry's First Sulfur-free Encapsulation Molding Compound for Copper Wires
- Feb 12, 2016
- Panasonic Commercializes Polybutylene Terephthalate (PBT) Molding Compounds for Laser Welding
2015
- Dec 24, 2015
- Panasonic Develops a Stretchable Resin Film and Its Application Materials For Stretchable Electronics
- Dec 21, 2015
- Panasonic to Start Production of Heat-Resistant Phenolic Molding Compounds for Automotive Parts in Ayutthaya, Thailand
- Oct 1, 2015
- Panasonic Commercializes High Heat-Resistant Semiconductor Encapsulation Material for Power Devices
2014
- June 12, 2014
- Panasonic develops "Full Bright PP" an optical reflective polypropylene resin molding compound
- May 28, 2014
- Panasonic Develops MEGTRON7 Multi-layer Circuit Board Material with the Industry's Lowest Transmission Loss*1
2013
- Oct 1, 2013
- Panasonic Establishes Electronic Materials South Asia R&D Center in Singapore
- June 11, 2013
- Announcing the release of thermosetting plastic molding-materials, “FULL BRIGHT”
- June 4, 2013
- Announcing the release of “ Fine-wiring electrode film ”
2012
