Oct 12, 2023
Panasonic Industry Demonstrates Durability of Electronic Materials in Exposure Experiments in Harsh Space Environment
May 15, 2023
Panasonic Industry Develops High-Thermal Conductive Film R-2400 for Multilayer Circuit Boards
Mar 16, 2023
Panasonic's Cutting-edge Electronic Materials for Aerospace Applications to Be Launched for Space Exposure Experiments
Aug 30, 2022
Price Revision on Semiconductor Encapsulation Materials
Aug 25, 2022
Panasonic Engages in Joint Research on Ultra-light EMC Shielding Material Development with JAXA
June 22, 2022
Panasonic to Conduct Space Exposure Experiments Aiming to Develop Cutting-edge Electronic Materials for Aerospace Applications
Jan 18, 2022
Panasonic Develops MEGTRON 8 Multi-Layer Circuit Board Materials Featuring Low Transmission Loss for High-Speed Communication Networking Equipment
Nov 10, 2021
Price Revision on Semiconductor Encapsulation Materials
Aug 6, 2021
Introduction of New Material For Next Generation Display Development TOUGHTELON
Jun 22, 2021
Panasonic Commercializes a New Semiconductor Substrate Material Designed to Improve Reliability
Mar 2, 2021
Panasonic Commercializes Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement
Feb 25, 2021
Panasonic Commercializes R-5410 Halogen-free Ultra-low Transmission Loss Multi-Layer Circuit Board Material for Millimeter-Wave Antennas
May 19, 2020
Exhibition information: ECTC 2020 Virtual Conference
Jan 7, 2020
Revocation of our exhibition to “12th AUTOMOTIVE WORLD 2020”
Oct 18, 2019
Current damage report and recovery status at Panasonic Koriyama plant due to Typhoon Hagibis
Jan 21, 2019
Panasonic Commercializes Halogen-free Multi-layer Circuit Board Material (Halogen-free MEGTRON6) for Communications Infrastructure Equipment
Dec 21, 2018
Exhibition infomation : AUTOMOTIVE WORLD Tokyo 2019
Dec 13, 2018
Panasonic to Bolster Substrate Material Business for Semiconductor Packages and Modules in China and North East Asian Region
Sep 3, 2018
Panasonic Commercializes Heat Resistant Underfill CV5794 Designed to Improve the Reliability of Automotive Electronics
Aug 29, 2018
Panasonic Commercializes Granular Epoxy Mold Compound (EMC) Semiconductor Encapsulation Materials for FOWLP and PLP
Jun 4, 2018
Panasonic Develops Glass Composite Circuit Board Material that Improves Parts Mounting Reliability
May 29, 2018
Panasonic Develops an Ultra-low Transmission Loss Circuit Board Material for Semiconductor Packages and Modules
Mar 9, 2018
Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations
Feb 8, 2018
Panasonic Launches Production of Molded Underfill Semiconductor Encapsulation Materials in Shanghai
Jan 11, 2018
Panasonic Develops "Halogen-free Ultra-low Transmission Loss Circuit Board Material" for Millimeter-wave Band Antennas
Jun 1, 2017
Panasonic Commercializes "High Thermal Conductivity, Low Transmission Loss Halogen-free Multi-layer Circuit Board Material" for Wireless Base Stations
May 12, 2017
Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations
Feb 3, 2017
Panasonic Develops Low-temperature Curing Secondary Mounting Underfill Material that Improves Mounting Reliability of Automotive Parts
Jan 17, 2017
Panasonic Commercializes Low Transmission Loss Flexible Multi-layer Circuit Board Materials
Dec 27, 2016
Price Revision for Copper clad Laminates and Mass Laminations
Dec 22, 2016
Panasonic Commercializes High Heat Resistance Halogen-free Multi-layer Circuit Board Material for Automotive Use
Aug 25, 2016
Panasonic Commercializes "Time-lagged UV Curing Adhesive" Suitable for Assembly of Mobile Phone Housings and UV-Protection Panels
May 30, 2016
Panasonic Commercializes a Substrate Material for Semiconductor Packages Featuring Reduced Internal Stress that Leads to Lower Warpage
May 26, 2016
Panasonic Commercializes "Sheet-Form Encapsulation Material for Coreless Package Substrates"
Apr 5, 2016
Panasonic Develops Light Diffusion Polypropylene Resin Molding Compounds "FULL BRIGHT" PP
Mar 18, 2016
Panasonic Commercializes a High Dielectric Constant Encapsulation Molding Compound Suitable for Finger-Print Sensor Packages
Mar 3, 2016
Panasonic Commercializes the Industry's First Sulfur-free Encapsulation Molding Compound for Copper Wires
Feb 12, 2016
Panasonic Commercializes Polybutylene Terephthalate (PBT) Molding Compounds for Laser Welding
Dec 24, 2015
Panasonic Develops a Stretchable Resin Film and Its Application Materials For Stretchable Electronics
Dec 21, 2015
Panasonic to Start Production of Heat-Resistant Phenolic Molding Compounds for Automotive Parts in Ayutthaya, Thailand
Oct 1, 2015
Panasonic Commercializes High Heat-Resistant Semiconductor Encapsulation Material for Power Devices
June 12, 2014
Panasonic develops "Full Bright PP" an optical reflective polypropylene resin molding compound
May 28, 2014
Panasonic Develops MEGTRON7 Multi-layer Circuit Board Material with the Industry's Lowest Transmission Loss*1
Oct 1, 2013
Panasonic Establishes Electronic Materials South Asia R&D Center in Singapore
June 11, 2013
Announcing the release of thermosetting plastic molding-materials,“FULL BRIGHT”
June 4, 2013
Announcing the release of “ Fine-wiring electrode film ”
June 13, 2012
The “Award JPCA (8th award)” was achieved to the “FELIOS LCP (liquid crystal polymer)” flexible circuit board materials.
February 27 ,2012
Announcing the release of the thermosetting plastic molding-materials“Full Bright”used for LED reflectors