Highly heat resistant Low CTE Multi-layer circuit board materials HIPER V | R-1755V - 파나소닉

Highly heat resistant Low CTE Multi-layer circuit board materials High-Tg type HIPER V R-1755V

Good for hybrid board with MEGTRON series. Standard loss material.

Circuit Board Materials

Part Number

HIPER V

Laminate R-1755V
Prepreg R-1650V

Application
Detailed use

Network

・Network

ICT infrastructure equipment, Measuring instrument, Etc.

Properties

Dk 4.4 Df 0.016
@1GHz

Tg(DSC)
173°C

T288(with copper)
20min

IST(Interconnect Stress Test)

IST(Interconnect Stress Test)

Solder heat resistance(float)

Solder heat resistance(float)

General properties

Item		Test method	Condition	Unit	HIPER V R-1755V
Glass transition temp(Tg)		DSC	A	°C	173
CTE z-axis	α1	IPC TM-650 2.4.24	A	ppm/°C	44
CTE z-axis	α2	IPC TM-650 2.4.24	A	ppm/°C	255
T288(with copper)		IPC TM-650 2.4.24.1	A	min	20
Dielectric constant(Dk)	1GHz	IPC TM-650 2.5.5.9	C-24/23/50	－	4.4
Dissipation factor(Df)	1GHz	IPC TM-650 2.5.5.9	C-24/23/50	－	0.016
Peel strength	1oz(35μm)	IPC TM-650 2.4.8	A	kN/m	1.5

The sample thickness is 0.8mm.

The above data are typical values and not guaranteed values.

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