In the AV and Computing fields where progress is being made to achieve the downsizing and reduced weight of equipment, Panasonic provides devices best suited to customer's needs.
Search by application
Point the mouse cursor to the system that you are interested in and click to see detailed information.
Search by product category
Point the mouse cursor to the product that you are interested in and click the product name to see the product details.
- Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap)
- Conductive Polymer Tantalum Solid Capacitors (POSCAP)
- Conductive Polymer Aluminum Solid Capacitors (OS-CON)
- Conductive Polymer Hybrid Aluminum Electrolytic Capacitors
- Film Capacitors (Electronic Equipment Use)
Thermal Management Solutions
- Narrow Pitch Connector for board to FPC
- High Current Connectors
- FPC/FFC Connector
- Narrow Pitch Connector for board to board
Batteries (for Business)
- Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP
- Flexible circuit board materials Resin coated copper foil FELIOS FRCC
- Halogen-free Multi-layer circuit board materials
- Low Dk Highly heat resistant Halogen-free Multi-layer circuit board materials
- Mass laminations(Shield board) "PreMulti"
- Glass composite circuit board materials
- Capillary Underfill(CUF) Semiconductor encapsulation materials
- Thin surface mounting semiconductor encapsulation materials
- For SMD module low warpage liquid encapsulant
- High elasticity Low CTE Ultra-thin IC substrate materials
- For secondary mounting reinforcement drop impact resistance liquid encapsulant
- Anti-Glare Type Anti-Reflection Films
- Clear Type Anti-Reflection Films
- Moldable Low-Reflection Films
- Anti-Rainbow and Anti-Blackout Films