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- Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series
- High frequency circuit board materials for wireless/RF applications "XPEDION"series
- Multi-layer Circuit Board Materials for Automotive Components "HIPER" series
- Circuit Board Materials for LED lightings "ECOOL" series
- Flexible Circuit Board Materials for Mobile Products "FELIOS" series
- Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series
- Glass Epoxy Circuit Board Materials
- Mass laminations(Shield board) "PreMulti"
- Glass Composite Circuit Board Materials
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- Semiconductor Device Materials
- IC Substrate Materials "LEXCM GX" series
- Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series
- Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
- Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series
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