- Improved connection reliability of circuit board for automotive by good CAF resistance.
- Available for high voltage and industry application.
Circuit Board Materials
- Part Number
Laminate R-1755M
Prepreg R-1650M
- Application
- Detailed use
・Automotive
・Industry
・Industry
Automotive component(ECU board), Photovoltaic(Inverter), Electronic equipment requiring high reliability(using lead-free solder), etc.
Properties
Tg (DSC)
153°C
153°C
Td (TGA)
355°C
355°C
CTE x-axis
40ppm/°C
40ppm/°C
Positioning of Glass transition temperature(Tg)
Through-hole reliability
Insulation reliability
General properties
| Item | Test method | Condition | Unit | HIPER M R-1755M | Conventional FR-4 R-1766 | |
| Glass transition temp.(Tg) | DSC | A | °C | 153 | 140 | |
| Thermal decomposition temp.(Td) | TGA | A | °C | 355 | 315 | |
| CTE x-axis | α1 | IPC TM-650 2.4.41 | A | ppm/°C | 11-13 | 11-13 |
| CTE y-axis | 13-15 | 13-15 | ||||
| CTE z-axis | α1 | IPC TM-650 2.4.24 | A | 40 | 65 | |
| α2 | 240 | 270 | ||||
| T288 (with copper) | IPC TM-650 2.4.24.1 | A | min | 18 | 1 | |
| Dielectric constant (Dk) | 1GHz | IPC TM-650 2.5.5.9 | C-24/23/50 | – | 4.6 | 4.3 |
| Dissipation factor (Df) | 0.014 | 0.016 | ||||
| Water absorption | IPC TM-650 2.6.2.1 | D-24/23 | % | 0.11 | 0.14 | |
| Flexural modulus | Warp | JIS C6481 | A | GPa | 24 | 23 |
| Fill | 22 | 21 | ||||
| Peel strength | 1oz(35μm) | IPC TM-650 2.4.8 | A | kN/m | 1.5 | 2.0 |
| Flammability | UL | C-48/23/50 | – | 94V-0 | 94V-0 | |
The sample thickness is 0.8mm.
The above data are typical values and not guaranteed values.
