High thermal conductivity Glass composite circuit board materials ECOOL | R-1787

High thermal conductivity Glass composite circuit board materials ECOOL R-1787

 

  1. Supporting thermal dissipation from PCB material that good for thermal conductivity property and processability because its resin board.

Circuit Board Materials

  • Part Number

Double-sided copper clad R-1787

  • Application
  • Detailed use
Appliance
・Appliance
LED lighting, LED-related equipment, Power supply application, Etc.

Properties

Thermal conductivity
1.1W/m·K
CTI≥600V
Excellent processability

LED thermal simulation

LED thermal simulation

General properties

Item Test method Condition Unit ECOOL
R-1787
Conventional
CEM-3
R-1786
Thermal conductivity Laser flash A W/m·K 1.10 0.45
Glass transition temp.(Tg) TMA Temp. rising rate:10°C/min °C 140 140
Solder heat resistance JIS C 6481  260°C solder float for 2min No abnormality No abnormality
Heat resistance 1oz JIS C 6481 A 230°C 60min 240°C 60min
Tracking resistance IEC 60112 A V CTI≥600 CTI≥600
Dielectric constant (Dk) 1MHz JIS C 6481 C-96/20/65 4.7 4.2
C-96/20/65+D-24/23 4.7 4.2
1GHz IPC-TM-650 2.5.5.9 C-24/23/50 4.5 4.0
Dissipation factor (Df) 1MHz JIS C 6481 C-96/20/65 0.010 0.011
C-96/20/65+D-24/23 0.010 0.011
1GHz IPC-TM-650 2.5.5.9 C-24/23/50 0.009 0.009
Insulation resistance JIS C 6481 C-96/20/65 1x10⁸ 5x10⁸
Flat-withstand voltage ASTM D149 A KV/mm 43 49

The sample thickness is 1.6mm.

The above data are typical values and not guaranteed values.

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