R-578Y(R) : Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series

Product
Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series

Series/Type
MEGTRON7 series Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials

Parts no
R-578Y(R)

Item Performance characteristics
Glass transition temp.(Tg) :DSC (°C) -
Glass transition temp.(Tg) :TMA (°C) -
Glass transition temp.(Tg) :DMA (°C) -
Thermal decomposition temp.(Td):TGA (°C) -
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1 (min) -
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1 (min) -
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C) -
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C) -
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) -
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) -
Thermal conductivity:Laser flash,25˚C (W/m·K) -
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm) -
Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ) -
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 -
Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 -
Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50 -
Dielectric constant(Dk)@14GHz:Balanced-type circular disk resonator,C-24/23/50 -
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 -
Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 -
Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50 -
Dissipation factor(Df)@14GHz:Balanced-type circular disk resonator,C-24/23/50 -
Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%) -
Flexural modulus,Warp/MD:JIS C 6481 (GPa) -
Flexural modulus,Fill/TD:JIS C 6481 (GPa) -
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch)) -
Peel Strength,1oz(H-VLP3):IPC-TM-650 2.4.8 (kN/m) -
Flammability:UL,C-48/23/50 -
The sample thickness -
The above data are typical values and not guaranteed values. -
*1 Test method: TMA -