Low CTE Ultra-thin IC substrate materials | R-G515S, R-G515E

Low CTE Ultra-thin IC substrate materials LEXCM GX R-G515


  1. With an insulation layer thickness of 15 μm or less, these ultra-thin materials enable thin IC package designs.
  2. The low CTE property can reduce warpage and achieve a good reliability.

Circuit Board Materials

  • Part Number

Low CTE glass cloth

Laminate R-G515S
Prepreg R-G510S

Normal glass cloth

Laminate R-G515E
Prepreg R-G510E

  • Application
  • Detailed use
IC substrate
CSP (PoP-Bottom, Flip-Chip, Memory, Module, etc.)

New branding announcement

  • Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.
    The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials (which includes substrates, encapsulants and underfills) and electronic assembly materials.
    Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.


CTE x,y-axis 4-6ppm/°C
(Low CTE glass cloth)
Low warpage
Excellent moldability

IC package warpage

IC Pakage Warpage

Melting and Curling Behavior

Melting and Curling Behavior

General properties

Item Test method Condition Unit LEXCM GX
Low CTE glass cloth
Normal glass cloth
Glass transition temp.(Tg) DMA* A °C 220-240 220-240
CTE x-axis α1 Internal method A ppm/°C 4-6 6-8
CTE y-axis 4-6 6-8
Young’s modulus ASTM D3039 25°C GPa 23-28 22-27
Peel strength 1/3oz IPC-TM-650 2.4.8 A kN/m 0.7 0.7

The sample thickness is 0.1 mm.
* DMA: Measurement in tensile mode

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),

The above data are typical values and not guaranteed values.

Related information